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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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8080-1G24CONN SOCKET TRANSIST TO-3 3POS |
380 |
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Datasheet |
- | Bulk | Obsolete | Transistor, TO-3 | 3 (Round) | Tin-Lead | 20.0µin (0.51µm) | Beryllium Copper | - | Chassis Mount | Closed Frame | Solder | - | Tin-Lead | -55°C ~ 125°C | 20.0µin (0.51µm) | Diallyl Phthalate (DAP) | Beryllium Copper |
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2013620-3CONN SOCKET PGA ZIF 989POS GOLD |
1,952 |
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Datasheet |
- | Tape & Reel (TR) | Active | PGA, ZIF (ZIP) | 989 (35 x 36) | Gold | 15.0µin (0.38µm) | Copper Alloy | 0.039" (1.00mm) | Surface Mount | Open Frame | Solder | 0.039" (1.00mm) | - | - | - | Thermoplastic | Copper Alloy |
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ICO-324-MGT100" LOW PROFILE SCREW MACHINE D |
1,315 |
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Datasheet |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyester, Glass Filled | Brass |
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ICA-324-SGG.100" SCREW MACHINE DIP SOCKET |
3,718 |
|
Datasheet |
ICA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polyester, Glass Filled | Brass |
|
123-43-624-41-801000CONN IC DIP SOCKET 24POS GOLD |
167 |
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Datasheet |
123 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame, Decoupling Capacitor | Wire Wrap | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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ICO-316-NGG.100" LOW PROFILE SCREW MACHINE |
1,648 |
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Datasheet |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polyester, Glass Filled | Brass |
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9-1437504-0CONN TRANSIST TO-3 3POS TIN |
4,084 |
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Datasheet |
8080 | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | Tin | 200.0µin (5.08µm) | Beryllium Copper | - | Chassis Mount | Closed Frame | Solder | - | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polytetrafluoroethylene (PTFE) | Beryllium Copper |
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8059-2G9CONN TRANSIST TO-5 10POS GOLD |
2,477 |
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Datasheet |
8059 | Bulk | Obsolete | Transistor, TO-5 | 10 (Round) | Gold | - | Copper Alloy | - | Through Hole | - | Solder | - | Gold | -55°C ~ 125°C | - | Polyamide (PA), Nylon, Glass Filled | Copper Alloy |
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ICF-324-S-O.100" SURFACE MOUNT SCREW MACHIN |
3,133 |
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Datasheet |
ICF | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Liquid Crystal Polymer (LCP) | Beryllium Copper |
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ICF-624-S-O.100" SURFACE MOUNT SCREW MACHIN |
3,234 |
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Datasheet |
ICF | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Liquid Crystal Polymer (LCP) | Beryllium Copper |
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ICO-628-MGTCONN IC DIP SOCKET 28POS GOLD |
1,773 |
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Datasheet |
ICO | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyester, Glass Filled | Brass |
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ICF-624-S-O-TR.100" SURFACE MOUNT SCREW MACHIN |
2,163 |
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Datasheet |
ICF | Tape & Reel (TR) | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Liquid Crystal Polymer (LCP) | Beryllium Copper |
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ICA-324-ZAGT.100" SCREW MACHINE DIP SOCKET |
4,496 |
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Datasheet |
ICA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyester, Glass Filled | Brass |
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ICO-628-SGG.100" LOW PROFILE SCREW MACHINE |
2,991 |
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Datasheet |
ICO | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polyester, Glass Filled | Brass |
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8080-1G14CONN SOCKET TRANSIST TO-3 3POS |
4,470 |
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Datasheet |
8080 | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | - | Through Hole | Closed Frame | Solder | - | Tin-Lead | -55°C ~ 125°C | - | Phenolic | Beryllium Copper |
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3-1437504-23-1437504-2 |
130 |
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Datasheet |
8080 | Box | Active | Transistor, TO-3 | 3 (Oval) | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | - | Through Hole | Closed Frame | Solder | - | Tin-Lead | -55°C ~ 125°C | - | Phenolic | Beryllium Copper |
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ICO-320-NGG.100" LOW PROFILE SCREW MACHINE |
4,377 |
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Datasheet |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polyester, Glass Filled | Brass |
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117-43-668-41-005000CONN IC DIP SOCKET 68POS GOLD |
198 |
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Datasheet |
117 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 68 (2 x 34) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.070" (1.78mm) | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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2040540-1CONN SOCKET LGA 1156POS GOLD |
3,474 |
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Datasheet |
- | Tray | Active | LGA | 1156 (34 x 34) | Gold | 15.0µin (0.38µm) | Copper Alloy | 0.036" (0.91mm) | Surface Mount | Closed Frame | Solder | 0.039" (1.00mm) | - | - | - | Thermoplastic | Copper Alloy |
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ICF-628-S-O.100" SURFACE MOUNT SCREW MACHIN |
3,239 |
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Datasheet |
ICF | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Liquid Crystal Polymer (LCP) | Beryllium Copper |
