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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1981837-2CONN SOCKET LGA 1366POS GOLD |
2,983 |
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Datasheet |
- | Tray | Obsolete | LGA | 1366 (32 x 41) | Gold | 30.0µin (0.76µm) | Copper Alloy | 0.040" (1.02mm) | Surface Mount | Open Frame | Solder | 0.040" (1.01mm) | - | - | - | Thermoplastic | Copper Alloy |
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APA-316-G-NADAPTER PLUG |
3,114 |
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Datasheet |
APA | Tube | Active | - | 16 (2 x 8) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | - | 20.0µin (0.51µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
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ICO-640-MGT.100" LOW PROFILE SCREW MACHINE |
1,620 |
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Datasheet |
ICO | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyester, Glass Filled | Brass |
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101-93-422-41-560000CONN IC DIP SOCKET 22POS GOLD |
486 |
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Datasheet |
101 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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110-93-420-41-001000CONN IC DIP SOCKET 20POS GOLD |
538 |
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Datasheet |
110 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 20 (2 x 10) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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299-43-632-10-002000CONN IC DIP SOCKET 32POS GOLD |
300 |
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Datasheet |
299 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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115-43-424-41-003000CONN IC DIP SOCKET 24POS GOLD |
488 |
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Datasheet |
115 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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ICF-640-S-O-TR.100" SURFACE MOUNT SCREW MACHIN |
1,761 |
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Datasheet |
ICF | Tape & Reel (TR) | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Liquid Crystal Polymer (LCP) | Beryllium Copper |
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ICO-640-NGT.100" LOW PROFILE SCREW MACHINE |
2,946 |
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Datasheet |
ICO | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyester, Glass Filled | Brass |
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116-93-318-41-007000CONN IC DIP SOCKET 18POS GOLD |
892 |
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Datasheet |
116 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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8059-2G5CONN SOCKET TRANSIST TO-5 8POS |
4,445 |
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Datasheet |
- | Bulk | Obsolete | Transistor, TO-5 | 8 (Round) | Gold | - | Copper Alloy | - | Through Hole | Closed Frame | Solder | - | Gold | -55°C ~ 125°C | - | Polyamide (PA), Nylon | Copper Alloy |
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2-1437531-2CONN IC DIP SOCKET 14POS GOLD |
4,387 |
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Datasheet |
500 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | - | Copper Alloy | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | - | - | Copper Alloy |
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117-93-628-41-005000CONN IC DIP SOCKET 28POS GOLD |
193 |
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Datasheet |
117 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.070" (1.78mm) | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
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3-1437508-1CONN TRANSIST TO-5 8POS GOLD |
3,603 |
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Datasheet |
8058 | Bulk | Obsolete | Transistor, TO-5 | 8 (Round) | Gold | - | Beryllium Copper | - | Through Hole | Closed Frame | Solder | - | Gold | -55°C ~ 125°C | - | Polytetrafluoroethylene (PTFE) | Brass |
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2-822114-3CONN SOCKET PQFP 144POS TIN-LEAD |
3,852 |
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Datasheet |
- | Tube | Obsolete | QFP | 144 (4 x 36) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Tin-Lead | - | 200.0µin (5.08µm) | Liquid Crystal Polymer (LCP) | Phosphor Bronze |
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2201838-2CONN SOCKET LGA 2011POS GOLD |
3,453 |
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Datasheet |
- | Bulk | Obsolete | LGA | 2011 (47 x 58) | Gold | 30.0µin (0.76µm) | Copper Alloy | 0.040" (1.02mm) | Surface Mount | Open Frame | Solder | 0.035" (0.90mm) | Gold | - | 30.0µin (0.76µm) | Thermoplastic | Copper Alloy |
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2201838-1CONN SOCKET LGA 2011POS GOLD |
4,709 |
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Datasheet |
- | Bulk | Obsolete | LGA | 2011 (47 x 58) | Gold | 15.0µin (0.38µm) | Copper Alloy | 0.040" (1.02mm) | Surface Mount | Open Frame | Solder | 0.035" (0.90mm) | Gold | - | 15.0µin (0.38µm) | Thermoplastic | Copper Alloy |
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ASPI0002-P001ASPI 8Pin WSON 8X6 |
3,430 |
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Datasheet |
- | Tape & Reel (TR) | Active | SOIC | 8 (2 x 4) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | 0.050" (1.27mm) | Surface Mount | Board Guide, Closed Frame | Solder | 0.050" (1.27mm) | Gold | - | Flash | Liquid Crystal Polymer (LCP) | Phosphor Bronze |
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ASPI0001-P001ASPI 8 PIN_IC 150mil |
1,710 |
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Datasheet |
- | Tape & Reel (TR) | Active | SOIC | 8 (2 x 4) | Gold | 1.00µin (0.025µm) | Phosphor Bronze | 0.050" (1.27mm) | Surface Mount | Board Guide, Closed Frame | Solder | 0.050" (1.27mm) | Gold | - | 1.00µin (0.025µm) | Liquid Crystal Polymer (LCP) | Phosphor Bronze |
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ACA-SPI-004-K01SPI 8 PIN_IC 208mil |
1,660 |
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Datasheet |
- | Tape & Reel (TR) | Active | SOIC | 8 (2 x 4) | Gold | 1.00µin (0.025µm) | Phosphor Bronze | 0.050" (1.27mm) | Surface Mount | Board Guide, Closed Frame | Solder | 0.050" (1.27mm) | Gold | - | 1.00µin (0.025µm) | Liquid Crystal Polymer (LCP) | Phosphor Bronze |
