| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SIP1X17-001BSIP1X17-001B-SIP SOCKET 17 CTS |
4,995 |
|
Datasheet |
SIP1x | Bulk | Active | SIP | 17 (1 x 17) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS), Glass Filled | Brass |
|
|
04-0513-11CONN SOCKET SIP 4POS GOLD |
2,023 |
|
Datasheet |
0513 | Bulk | Active | SIP | 4 (1 x 4) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | - | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
2-382714-1CONN IC DIP SOCKET 20POS TIN |
2,129 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 20 (2 x 10) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic, Glass Filled | Beryllium Copper |
|
|
1051631001SMIA65 CAMERA SOCKET CONTACT |
3,579 |
|
Datasheet |
105163 | Tape & Reel (TR) | Obsolete | Camera Socket | 12 (2 x 6) | Gold | 12.0µin (0.30µm) | Copper Alloy | 0.037" (0.95mm) | Surface Mount, Through Board | Open Frame | Solder | 0.037" (0.95mm) | Gold | -55°C ~ 85°C | Flash | Thermoplastic | Copper Alloy |
|
|
1051900001TOP-MOUNT CAMERA SOCKET FOR SMIA |
2,507 |
|
Datasheet |
105190 | Tape & Reel (TR) | Obsolete | Camera Socket | 12 (2 x 6) | Gold | 12.0µin (0.30µm) | Phosphor Bronze Alloy | 0.033" (0.85mm) | Surface Mount | Open Frame | Solder | 0.033" (0.85mm) | Gold | -55°C ~ 85°C | Flash | Thermoplastic | Phosphor Bronze Alloy |
|
|
540-88-032-17-400CONN SOCKET PLCC 32POS TIN |
4,798 |
|
Datasheet |
540 | Bulk | Active | PLCC | 32 (4 x 8) | Tin | - | Phosphor Bronze | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | - | Polyphenylene Sulfide (PPS) | Phosphor Bronze |
|
808-AG11D-ESL-LFCONN IC DIP SOCKET 8POS GOLD |
3,469 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 105°C | Flash | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Copper |
|
116-83-306-41-007101CONN IC DIP SOCKET 6POS GOLD |
1,951 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
115-87-316-41-003101CONN IC DIP SOCKET 16POS GOLD |
2,351 |
|
Datasheet |
115 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
AR 24 HGL-TTSOCKET |
4,903 |
|
Datasheet |
AR | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -40°C ~ 105°C | Flash | Polybutylene Terephthalate (PBT), Glass Filled | Brass |
|
|
AR 24 HGL/7-TTSOCKET |
4,460 |
|
Datasheet |
AR | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -40°C ~ 105°C | Flash | Polybutylene Terephthalate (PBT), Glass Filled | Brass |
|
110-87-320-41-005101CONN IC DIP SOCKET 20POS GOLD |
2,593 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
110-87-320-41-605101CONN IC DIP SOCKET 20POS GOLD |
2,585 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
233-84CONN SOCKET PLCC 84POS TIN |
4,146 |
|
Datasheet |
- | Tube | Obsolete | PLCC | 84 (4 x 21) | Tin | - | Phosphor Bronze | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
|
3-382568-2CONN IC DIP SOCKET 32POS TIN |
3,978 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic, Glass Filled | Phosphor Bronze |
|
|
614-83-308-31-012101CONN IC DIP SOCKET 8POS GOLD |
2,450 |
|
Datasheet |
614 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
114-83-308-41-134191CONN IC DIP SOCKET 8POS GOLD |
3,316 |
|
Datasheet |
114 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
A22-LCG-T-RCONN IC DIP SOCKET 22POS GOLD |
4,233 |
|
Datasheet |
- | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | Gold | - | - | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 105°C | - | Polybutylene Terephthalate (PBT), Glass Filled | - |
|
|
SIP050-1X10-160B1X10-160B-SIP SOCKET 10 CTS |
2,215 |
|
Datasheet |
SIP050-1x | Bulk | Active | SIP | 10 (1 x 10) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
SU1210200000GSU-2*6P RED ; 10.0MM CLIP PLATI |
1,379 |
|
Datasheet |
SU | Bulk | Active | DIP, 0.1" (2.54mm) Row Spacing | 12 (2 x 6) | Tin | 200.0µin (5.08µm) | Brass | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -40°C ~ 105°C | 30.0µin (0.76µm) | Polyphenylene Sulfide (PPS) | Beryllium Copper |
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