| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
116-83-316-41-012101CONN IC DIP SOCKET 16POS GOLD |
1,592 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
18-0513-10TCONN SOCKET SIP 18POS GOLD |
3,400 |
|
Datasheet |
0513 | Bulk | Active | SIP | 18 (1 x 18) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
03-0503-21CONN SOCKET SIP 3POS GOLD |
3,223 |
|
Datasheet |
0503 | Bulk | Active | SIP | 3 (1 x 3) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Gold | - | 10.0µin (0.25µm) | Polyamide (PA), Nylon, Glass Filled | Brass |
|
|
03-0503-31CONN SOCKET SIP 3POS GOLD |
4,917 |
|
Datasheet |
0503 | Bulk | Active | SIP | 3 (1 x 3) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Gold | - | 10.0µin (0.25µm) | Polyamide (PA), Nylon, Glass Filled | Brass |
|
|
22-4518-10TCONN IC DIP SOCKET 22POS GOLD |
1,917 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
212-1-14-003CONN IC DIP SOCKET 14POS GOLD |
1,833 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Polybutylene Terephthalate (PBT) | Brass |
|
|
HLS-0203-T-10.100" SCREW MACHINE SOCKET ARRAY |
2,413 |
|
Datasheet |
HLS | Tube | Active | SIP | 6 (2 x 3) | Tin | - | - | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | -55°C ~ 140°C | - | Thermoplastic | - |
|
110-83-628-41-001101CONN IC DIP SOCKET 28POS GOLD |
1,567 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
110-83-628-41-001151CONN IC DIP SOCKET 28POS GOLD |
3,599 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame, No Center Bar | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
1-822473-7CONN SOCKET PLCC 84POS TIN |
4,292 |
|
Datasheet |
- | Box | Obsolete | PLCC | 84 (4 x 21) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | 100.0µin (2.54µm) | Thermoplastic | Phosphor Bronze |
|
|
400-028-050CONN IC DIP SOCKET 28POS GOLD |
1,663 |
|
Datasheet |
400 | Box | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 8.00µin (0.203µm) | - | 0.100" (2.54mm) | Through Hole | Open Frame | - | 0.100" (2.54mm) | Gold | - | 8.00µin (0.203µm) | - | - |
|
|
06-6513-11CONN IC DIP SOCKET 6POS GOLD |
2,440 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 6 (2 x 3) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 105°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
12-0518-11CONN SOCKET SIP 12POS GOLD |
2,210 |
|
Datasheet |
518 | Bulk | Active | SIP | 12 (1 x 12) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | - | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
12-1518-11CONN IC DIP SOCKET 12POS GOLD |
2,731 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 12 (2 x 6) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | - | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
D0924-42CONN IC DIP SOCKET 24POS GOLD |
2,027 |
|
Datasheet |
D0 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 196.9µin (5.00µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
822-AG11D-ESL-LFCONN IC DIP SOCKET 22POS GOLD |
4,943 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 105°C | Flash | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Copper |
|
116-87-316-41-001101CONN IC DIP SOCKET 16POS GOLD |
1,634 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
116-83-310-41-004101CONN IC DIP SOCKET 10POS GOLD |
4,340 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
A-ICS-254-14-TT50IC SOCKET, MACHINED PIN, 7.62MM, |
3,800 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 | Nickel | 78.7µin (2.00µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole, Right Angle | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 78.7µin (2.00µm) | Polybutylene Terephthalate (PBT), Glass Filled | Brass |
|
116-87-322-41-012101CONN IC DIP SOCKET 22POS GOLD |
4,981 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
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