| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
3-1437535-4CONN SOCKET SIP 20POS GOLD |
3,712 |
|
Datasheet |
500 | Bulk | Obsolete | SIP | 20 (1 x 20) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | 10.0µin (0.25µm) | - | Beryllium Copper |
|
|
115-83-428-41-001101CONN IC DIP SOCKET 28POS GOLD |
1,571 |
|
Datasheet |
115 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 28 (2 x 14) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
SIP050-1X31-157B1X31-157B-SIP SOCKET 31 CTS |
3,718 |
|
Datasheet |
SIP050-1x | Bulk | Active | SIP | 31 (1 x 31) | Tin | 200.0µin (5.08µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
AR 24-HZL/07/7-TTCONN IC DIP SOCKET 24POS GOLD |
4,877 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Thermoplastic, Polyester | Beryllium Copper |
|
117-83-428-41-005101CONN IC DIP SOCKET 28POS GOLD |
4,234 |
|
Datasheet |
117 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 28 (2 x 14) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.070" (1.78mm) | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
146-87-320-41-035101CONN IC DIP SOCKET 20POS GOLD |
1,537 |
|
Datasheet |
146 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
146-87-320-41-036101CONN IC DIP SOCKET 20POS GOLD |
1,983 |
|
Datasheet |
146 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
614-87-628-41-001101CONN IC DIP SOCKET 28POS GOLD |
4,304 |
|
Datasheet |
614 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
18-0513-10CONN SOCKET SIP 18POS GOLD |
2,573 |
|
Datasheet |
0513 | Bulk | Active | SIP | 18 (1 x 18) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
10-0518-11HCONN SOCKET SIP 10POS GOLD |
2,954 |
|
Datasheet |
518 | Bulk | Active | SIP | 10 (1 x 10) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | - | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
10-1518-11HCONN IC DIP SOCKET 10POS GOLD |
2,049 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | - | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
HLS-0104-T-32.100" SCREW MACHINE SOCKET ARRAY |
4,386 |
|
Datasheet |
HLS | Tube | Active | SIP | 4 (1 x 4) | Tin | - | - | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | -55°C ~ 140°C | - | Thermoplastic | - |
|
117-83-628-41-005101CONN IC DIP SOCKET 28POS GOLD |
2,782 |
|
Datasheet |
117 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.070" (1.78mm) | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
SMPX-52LCC-N-TRSMT PLCC 52P NON POLARISED, T&R |
3,754 |
|
Datasheet |
SMPX | Tape & Reel (TR) | Active | PLCC | 52 (4 x 13) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | -50°C ~ 105°C | - | Thermoplastic, Glass Filled | Phosphor Bronze |
|
|
110-83-314-41-801101CONN IC DIP SOCKET 14POS GOLD |
1,423 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
06-3513-11HCONN IC DIP SOCKET 6POS GOLD |
2,855 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 105°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
ICF-314-TL-O-TR.100" SURFACE MOUNT SCREW MACHIN |
1,004 |
|
Datasheet |
ICF | Tape & Reel (TR) | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Liquid Crystal Polymer (LCP) | Beryllium Copper |
|
|
08-3511-10CONN IC DIP SOCKET 8POS TIN |
3,456 |
|
Datasheet |
511 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Phosphor Bronze |
|
|
18-1518-10TCONN IC DIP SOCKET 18POS GOLD |
1,271 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 18 (2 x 9) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
11-0518-00CONN SOCKET SIP 11POS GOLD |
2,987 |
|
Datasheet |
518 | Bulk | Active | SIP | 11 (1 x 11) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
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