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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
510-87-081-09-000101

510-87-081-09-000101

CONN SOCKET PGA 81POS GOLD

Preci-Dip

3,607
510-87-081-09-000101

Datasheet

510 Bulk Active PGA 81 (9 x 9) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
510-87-069-11-061101

510-87-069-11-061101

CONN SOCKET PGA 69POS GOLD

Preci-Dip

3,921
510-87-069-11-061101

Datasheet

510 Bulk Active PGA 69 (11 x 11) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
124-83-316-41-002101

124-83-316-41-002101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

3,784
124-83-316-41-002101

Datasheet

124 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
116-87-322-41-001101

116-87-322-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2,157
116-87-322-41-001101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
1571541-2

1571541-2

CONN SOCKET PLCC 52POS TIN

TE Connectivity AMP Connectors

2,433
1571541-2

Datasheet

PCS Bulk Obsolete PLCC 52 (4 x 13) Tin 180.0µin (4.57µm) Copper Alloy 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 180.0µin (4.57µm) Polyphenylene Sulfide (PPS) Copper Alloy
HLS-0113-TT-11

HLS-0113-TT-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

4,697
HLS-0113-TT-11

Datasheet

HLS Tube Active SIP 13 (1 x 13) Tin - - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 140°C - Thermoplastic -
110-83-628-41-105101

110-83-628-41-105101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3,184
110-83-628-41-105101

Datasheet

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
33-0518-10

33-0518-10

CONN SOCKET SIP 33POS GOLD

Aries Electronics

4,830
33-0518-10

Datasheet

518 Bulk Active SIP 33 (1 x 33) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
08-0508-20

08-0508-20

CONN SOCKET SIP 8POS GOLD

Aries Electronics

1,597
08-0508-20

Datasheet

508 Bulk Active SIP 8 (1 x 8) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Wire Wrap - Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6 Brass
08-0508-30

08-0508-30

CONN SOCKET SIP 8POS GOLD

Aries Electronics

4,498
08-0508-30

Datasheet

508 Bulk Active SIP 8 (1 x 8) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Wire Wrap - Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6 Brass
08-1508-20

08-1508-20

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

4,701
08-1508-20

Datasheet

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6 Brass
08-1508-30

08-1508-30

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

1,008
08-1508-30

Datasheet

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6 Brass
14-C280-10T

14-C280-10T

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

1,938
14-C280-10T

Datasheet

EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
146-87-324-41-035101

146-87-324-41-035101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

1,667
146-87-324-41-035101

Datasheet

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
146-87-324-41-036101

146-87-324-41-036101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

1,522
146-87-324-41-036101

Datasheet

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
116-83-320-41-002101

116-83-320-41-002101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

1,609
116-83-320-41-002101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
ICO-314-NTT

ICO-314-NTT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

2,479
ICO-314-NTT

Datasheet

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin - Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C - Polyester, Glass Filled Brass
HLS-0107-G-2

HLS-0107-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

2,568
HLS-0107-G-2

Datasheet

HLS Tube Active SIP 7 (1 x 7) Gold 30.0µin (0.76µm) - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 140°C 10.0µin (0.25µm) Thermoplastic -
ICF-318-TM-O

ICF-318-TM-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

4,406
ICF-318-TM-O

Datasheet

ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Tin - Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Liquid Crystal Polymer (LCP) Beryllium Copper
ICF-318-T-I

ICF-318-T-I

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

1,324
ICF-318-T-I

Datasheet

ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Tin - Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Liquid Crystal Polymer (LCP) Beryllium Copper
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