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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
38-0518-10

38-0518-10

CONN SOCKET SIP 38POS GOLD

Aries Electronics

2,872
38-0518-10

Datasheet

518 Bulk Active SIP 38 (1 x 38) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
40-0518-10T

40-0518-10T

CONN SOCKET SIP 40POS GOLD

Aries Electronics

3,146
40-0518-10T

Datasheet

518 Bulk Active SIP 40 (1 x 40) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
122-83-624-41-001101

122-83-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2,112
122-83-624-41-001101

Datasheet

122 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
123-83-624-41-001101

123-83-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

4,125
123-83-624-41-001101

Datasheet

123 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
ICO-314-SST

ICO-314-SST

CONN IC DIP SOCKET 14POS GOLD

Samtec Inc.

1,290
ICO-314-SST

Datasheet

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polyester, Glass Filled Brass
HLS-0207-TT-10

HLS-0207-TT-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

1,073
HLS-0207-TT-10

Datasheet

HLS Tube Active SIP 14 (2 x 7) Tin - - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 140°C - Thermoplastic -
ICO-422-STT-L

ICO-422-STT-L

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

4,497
ICO-422-STT-L

Datasheet

ICO Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Tin - Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C - Polyester, Glass Filled Brass
116-83-628-41-003101

116-83-628-41-003101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2,264
116-83-628-41-003101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
28-0518-10

28-0518-10

CONN SOCKET SIP 28POS GOLD

Aries Electronics

4,832
28-0518-10

Datasheet

518 Bulk Active SIP 28 (1 x 28) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
28-1518-10

28-1518-10

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

4,368
28-1518-10

Datasheet

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
HLS-0208-TT-11

HLS-0208-TT-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

2,346
HLS-0208-TT-11

Datasheet

HLS Tube Active SIP 16 (2 x 8) Tin - - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 140°C - Thermoplastic -
ICA-314-SST-L

ICA-314-SST-L

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

1,624
ICA-314-SST-L

Datasheet

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polyester, Glass Filled Brass
116-83-324-41-012101

116-83-324-41-012101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

4,084
116-83-324-41-012101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
20-3518-10H

20-3518-10H

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,548
20-3518-10H

Datasheet

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
1-1437537-1

1-1437537-1

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors

3,489
1-1437537-1

Datasheet

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 25.0µin (0.63µm) Copper Alloy 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) - -55°C ~ 125°C - Thermoplastic Brass
08-2501-30

08-2501-30

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

4,803
08-2501-30

Datasheet

501 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
10-2513-11H

10-2513-11H

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

4,549
10-2513-11H

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 105°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
17-0513-11

17-0513-11

CONN SOCKET SIP 17POS GOLD

Aries Electronics

3,333
17-0513-11

Datasheet

0513 Bulk Active SIP 17 (1 x 17) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
08-3518-01

08-3518-01

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,021
08-3518-01

Datasheet

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
ICF-624-STL-I-TR

ICF-624-STL-I-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

3,106
ICF-624-STL-I-TR

Datasheet

ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Tin - Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Liquid Crystal Polymer (LCP) Beryllium Copper
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