| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
04-7533-10CONN SOCKET SIP 4POS TIN |
1,054 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 4 (1 x 4) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Phosphor Bronze |
|
|
04-7550-10CONN SOCKET SIP 4POS TIN |
1,382 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 4 (1 x 4) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Phosphor Bronze |
|
|
04-7560-10CONN SOCKET SIP 4POS TIN |
2,746 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 4 (1 x 4) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Phosphor Bronze |
|
|
04-7700-10CONN SOCKET SIP 4POS TIN |
4,587 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 4 (1 x 4) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Phosphor Bronze |
|
|
04-7755-10CONN SOCKET SIP 4POS TIN |
1,698 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 4 (1 x 4) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Phosphor Bronze |
|
|
04-7800-10CONN SOCKET SIP 4POS TIN |
1,728 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 4 (1 x 4) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Phosphor Bronze |
|
|
04-7850-10CONN SOCKET SIP 4POS TIN |
2,548 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 4 (1 x 4) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Phosphor Bronze |
|
|
04-7950-10CONN SOCKET SIP 4POS TIN |
2,557 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 4 (1 x 4) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Phosphor Bronze |
|
|
115-83-952-41-001101CONN IC DIP SOCKET 52POS GOLD |
4,141 |
|
Datasheet |
115 | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 52 (2 x 26) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
HLS-0303-G-11.100" SCREW MACHINE SOCKET ARRAY |
4,036 |
|
Datasheet |
HLS | Tube | Active | SIP | 9 (3 x 3) | Gold | 30.0µin (0.76µm) | - | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 140°C | 10.0µin (0.25µm) | Thermoplastic | - |
|
|
22-16-2CONN SOCKET TRANSIST 3POS GOLD |
2,755 |
|
Datasheet |
22 | Bulk | Obsolete | Transistor | 3 (Round) | Gold | - | Beryllium Copper | - | Through Hole | Closed Frame | Solder | - | Gold | - | - | Thermoplastic, Glass Filled | Beryllium Copper |
|
|
22-16-3CONN SOCKET TRANSIST 3POS GOLD |
4,667 |
|
Datasheet |
22 | Bulk | Obsolete | Transistor | 3 (Round) | Gold | - | Beryllium Copper | - | Through Hole | Closed Frame | Solder | - | Gold | - | - | Thermoplastic, Glass Filled | Beryllium Copper |
|
|
510-83-081-09-000101CONN SOCKET PGA 81POS GOLD |
2,071 |
|
Datasheet |
510 | Bulk | Active | PGA | 81 (9 x 9) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
510-83-081-12-071101CONN SOCKET PGA 81POS GOLD |
3,357 |
|
Datasheet |
510 | Bulk | Active | PGA | 81 (12 x 12) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
117-83-640-41-105101CONN IC DIP SOCKET 40POS GOLD |
1,570 |
|
Datasheet |
117 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.070" (1.78mm) | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
524-AG10D-ESCONN IC DIP SOCKET 24POS GOLD |
4,779 |
|
Datasheet |
500 | Tube | Obsolete | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | Gold | 25.0µin (0.63µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | -55°C ~ 125°C | - | - | Brass |
|
|
ICO-322-SST.100" LOW PROFILE SCREW MACHINE |
2,185 |
|
Datasheet |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polyester, Glass Filled | Brass |
|
|
146-83-432-41-035101CONN IC DIP SOCKET 32POS GOLD |
3,591 |
|
Datasheet |
146 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 32 (2 x 16) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
40-6513-1040 POS LOW PROF SOCK SERIES 513 |
2,400 |
|
Datasheet |
513 | - | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
14-C195-11CONN IC DIP SOCKET 14POS GOLD |
4,227 |
|
Datasheet |
EJECT-A-DIP™ | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
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