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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
10-822-90C

10-822-90C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3,112
10-822-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
APO-316-T-C

APO-316-T-C

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

2,081
APO-316-T-C

Datasheet

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Tin - Phosphor Bronze 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - - Polybutylene Terephthalate (PBT), Glass Filled Phosphor Bronze
116-83-432-41-011101

116-83-432-41-011101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

4,072
116-83-432-41-011101

Datasheet

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
510-83-088-12-051101

510-83-088-12-051101

CONN SOCKET PGA 88POS GOLD

Preci-Dip

1,115
510-83-088-12-051101

Datasheet

510 Bulk Active PGA 88 (12 x 12) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
AR 28-HZL/07-TT

AR 28-HZL/07-TT

CONN IC DIP SOCKET 28POS GOLD

Assmann WSW Components

2,090
AR 28-HZL/07-TT

Datasheet

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -40°C ~ 105°C 200.0µin (5.08µm) Thermoplastic, Polyester Beryllium Copper
08-0503-21

08-0503-21

CONN SOCKET SIP 8POS GOLD

Aries Electronics

4,359
08-0503-21

Datasheet

0503 Bulk Active SIP 8 (1 x 8) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Wire Wrap 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyamide (PA), Nylon, Glass Filled Brass
08-0503-31

08-0503-31

CONN SOCKET SIP 8POS GOLD

Aries Electronics

1,453
08-0503-31

Datasheet

0503 Bulk Active SIP 8 (1 x 8) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Wire Wrap 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyamide (PA), Nylon, Glass Filled Brass
14-3518-10M

14-3518-10M

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

1,186
14-3518-10M

Datasheet

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
HLS-0207-T-11

HLS-0207-T-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

4,573
HLS-0207-T-11

Datasheet

HLS Tube Active SIP 14 (2 x 7) Tin - - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) - -55°C ~ 140°C - Thermoplastic -
APO-422-T-A1

APO-422-T-A1

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

2,307
APO-422-T-A1

Datasheet

APO Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Tin - Phosphor Bronze 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - - Polybutylene Terephthalate (PBT), Glass Filled Phosphor Bronze
299-87-620-10-002101

299-87-620-10-002101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

4,816
299-87-620-10-002101

Datasheet

299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
HLS-0206-T-18

HLS-0206-T-18

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

4,160
HLS-0206-T-18

Datasheet

HLS Tube Active SIP 12 (2 x 6) Tin - - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) - -55°C ~ 140°C - Thermoplastic -
212-1-40-006

212-1-40-006

CONN IC DIP SOCKET 40POS GOLD

CNC Tech

1,350
212-1-40-006

Datasheet

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold - Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin -40°C ~ 105°C 200.0µin (5.08µm) Polybutylene Terephthalate (PBT) Brass
116-83-632-41-011101

116-83-632-41-011101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

1,274
116-83-632-41-011101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
APO-316-T-A

APO-316-T-A

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

1,321
APO-316-T-A

Datasheet

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Tin - Phosphor Bronze 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - - Polybutylene Terephthalate (PBT), Glass Filled Phosphor Bronze
APH-0902-G-H

APH-0902-G-H

APH-0902-G-H

Samtec Inc.

1,780
APH-0902-G-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1002-G-H

APH-1002-G-H

APH-1002-G-H

Samtec Inc.

3,940
APH-1002-G-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1902-G-H

APH-1902-G-H

APH-1902-G-H

Samtec Inc.

1,360
APH-1902-G-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1602-G-H

APH-1602-G-H

APH-1602-G-H

Samtec Inc.

1,978
APH-1602-G-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0202-G-H

APH-0202-G-H

APH-0202-G-H

Samtec Inc.

4,814
APH-0202-G-H

Datasheet

* - Active - - - - - - - - - - - - - - -
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