| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
PGA168H003B1-1706RPGA SOCKET 168 CTS |
4,697 |
|
Datasheet |
- | - | Active | PGA | 168 (17 x 17) | Gold | 30.0µin (0.76µm) | - | 0.100" (2.54mm) | Through Hole | Open Frame | - | - | - | - | - | - | - |
|
116-83-628-41-004101CONN IC DIP SOCKET 28POS GOLD |
4,583 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
ICO-318-ZNGT.100" LOW PROFILE SCREW MACHINE |
3,824 |
|
Datasheet |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyester, Glass Filled | Brass |
|
|
APA-316-G-JADAPTER PLUG |
4,372 |
|
Datasheet |
APA | Tube | Active | - | 16 (2 x 8) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | - | 20.0µin (0.51µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
|
116-83-652-41-003101CONN IC DIP SOCKET 52POS GOLD |
1,388 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 52 (2 x 26) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
714-43-117-31-018000CONN SOCKET SIP 17POS GOLD |
4,825 |
|
Datasheet |
714 | Bulk | Active | SIP | 17 (1 x 17) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
50-9513-10TCONN IC DIP SOCKET 50POS GOLD |
2,961 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 50 (2 x 25) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
09-0508-21CONN SOCKET SIP 9POS GOLD |
3,330 |
|
Datasheet |
508 | Bulk | Active | SIP | 9 (1 x 9) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Wire Wrap | - | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6 | Brass |
|
|
09-0508-31CONN SOCKET SIP 9POS GOLD |
2,770 |
|
Datasheet |
508 | Bulk | Active | SIP | 9 (1 x 9) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Wire Wrap | - | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6 | Brass |
|
|
10-2822-90CCONN IC DIP SOCKET 10POS GOLD |
2,858 |
|
Datasheet |
Vertisockets™ 800 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
50-9518-10TCONN IC DIP SOCKET 50POS GOLD |
4,980 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 50 (2 x 25) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
28-3518-10MCONN IC DIP SOCKET 28POS GOLD |
3,329 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
612-83-950-41-001101CONN IC DIP SOCKET 50POS GOLD |
4,705 |
|
Datasheet |
612 | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 50 (2 x 25) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
33-0518-00CONN SOCKET SIP 33POS GOLD |
4,540 |
|
Datasheet |
518 | Bulk | Active | SIP | 33 (1 x 33) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
ICO-314-ZCGT.100" LOW PROFILE SCREW MACHINE |
3,582 |
|
Datasheet |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyester, Glass Filled | Brass |
|
|
ICF-632-SM-O-TR.100" SURFACE MOUNT SCREW MACHIN |
3,294 |
|
Datasheet |
ICF | Tape & Reel (TR) | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Liquid Crystal Polymer (LCP) | Beryllium Copper |
|
|
HLS-0209-G-2.100" SCREW MACHINE SOCKET ARRAY |
4,721 |
|
Datasheet |
HLS | Tube | Active | SIP | 18 (2 x 9) | Gold | 30.0µin (0.76µm) | - | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 140°C | 10.0µin (0.25µm) | Thermoplastic | - |
|
|
1-1437508-7CONN SOCKET TRANSIST TO-5 8POS |
4,725 |
|
Datasheet |
8058 | Bulk | Obsolete | Transistor, TO-5 | 8 (Round) | Gold | - | Beryllium Copper | - | Through Hole | Closed Frame | Solder | - | Gold | -55°C ~ 125°C | - | Polytetrafluoroethylene (PTFE) | Brass |
|
|
48-6513-10CONN IC DIP SOCKET 48POS GOLD |
4,463 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
24-3513-10HCONN IC DIP SOCKET 24POS GOLD |
3,139 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
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