Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































Apply All
Reset All
Result
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
06-0501-21

06-0501-21

CONN SOCKET SIP 6POS GOLD

Aries Electronics

3,911
06-0501-21

Datasheet

501 Bulk Active SIP 6 (1 x 6) Gold 10.0µin (0.25µm) Phosphor Bronze 0.100" (2.54mm) Through Hole - Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
06-0501-31

06-0501-31

CONN SOCKET SIP 6POS GOLD

Aries Electronics

3,968
06-0501-31

Datasheet

501 Bulk Active SIP 6 (1 x 6) Gold 10.0µin (0.25µm) Phosphor Bronze 0.100" (2.54mm) Through Hole - Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
15-0503-30

15-0503-30

CONN SOCKET SIP 15POS GOLD

Aries Electronics

3,107
15-0503-30

Datasheet

0503 Bulk Active SIP 15 (1 x 15) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Wire Wrap 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA), Nylon, Glass Filled Brass
26-1518-11H

26-1518-11H

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

2,632
26-1518-11H

Datasheet

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 26 (2 x 13) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
ICO-318-MGG

ICO-318-MGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

2,838
ICO-318-MGG

Datasheet

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 30.0µin (0.76µm) Polyester, Glass Filled Brass
116-83-642-41-001101

116-83-642-41-001101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

1,295
116-83-642-41-001101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
ICA-320-ZWGT-3

ICA-320-ZWGT-3

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

4,964
ICA-320-ZWGT-3

Datasheet

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 10.0µin (0.25µm) Polyester, Glass Filled Brass
116-83-650-41-007101

116-83-650-41-007101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

3,933
116-83-650-41-007101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
20-4518-11H

20-4518-11H

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,775
20-4518-11H

Datasheet

518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
20-0517-90C

20-0517-90C

CONN SOCKET SIP 20POS GOLD

Aries Electronics

2,075
20-0517-90C

Datasheet

0517 Bulk Active SIP 20 (1 x 20) Gold 30.0µin (0.76µm) Beryllium Copper - Through Hole, Right Angle - Solder - Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
510-87-181-15-001101

510-87-181-15-001101

CONN SOCKET PGA 181POS GOLD

Preci-Dip

2,050
510-87-181-15-001101

Datasheet

510 Bulk Active PGA 181 (15 x 15) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
510-87-181-15-051101

510-87-181-15-051101

CONN SOCKET PGA 181POS GOLD

Preci-Dip

3,028
510-87-181-15-051101

Datasheet

510 Bulk Active PGA 181 (15 x 15) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
614-43-632-31-012000

614-43-632-31-012000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

3,990
614-43-632-31-012000

Datasheet

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
ICO-314-ZNGG

ICO-314-ZNGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

1,866
ICO-314-ZNGG

Datasheet

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 30.0µin (0.76µm) Polyester, Glass Filled Brass
APH-0906-T-H

APH-0906-T-H

APH-0906-T-H

Samtec Inc.

4,360
APH-0906-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0606-T-H

APH-0606-T-H

APH-0606-T-H

Samtec Inc.

3,205
APH-0606-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1706-T-H

APH-1706-T-H

APH-1706-T-H

Samtec Inc.

1,943
APH-1706-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0706-T-H

APH-0706-T-H

APH-0706-T-H

Samtec Inc.

3,100
APH-0706-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0806-T-H

APH-0806-T-H

APH-0806-T-H

Samtec Inc.

4,673
APH-0806-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
116-83-650-41-012101

116-83-650-41-012101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

1,066
116-83-650-41-012101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
Total 19086 Record«Prev1... 336337338339340341342343...955Next»

Frequently Asked Questions

IC Sockets Overview

Search Product

Search

Product Category

Products

Tel Us

Phone

My Acccout

User

OEM STOCK
OEM STOCK
[email protected]