| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
104-13-304-41-780000CONN IC DIP SOCKET 4POS GOLD |
2,535 |
|
Datasheet |
104 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Gold | - | 10.0µin (0.25µm) | Thermoplastic | Brass Alloy |
|
|
11-0508-21CONN SOCKET SIP 11POS GOLD |
2,425 |
|
Datasheet |
508 | Bulk | Active | SIP | 11 (1 x 11) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Wire Wrap | - | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6 | Brass |
|
|
11-0508-31CONN SOCKET SIP 11POS GOLD |
3,520 |
|
Datasheet |
508 | Bulk | Active | SIP | 11 (1 x 11) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Wire Wrap | - | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6 | Brass |
|
|
12-8312-310CCONN IC DIP SOCKET 12POS GOLD |
1,328 |
|
Datasheet |
8 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 12 (2 x 6) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 105°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
12-8355-310CCONN IC DIP SOCKET 12POS GOLD |
3,077 |
|
Datasheet |
8 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 12 (2 x 6) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 105°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
12-8358-310CCONN IC DIP SOCKET 12POS GOLD |
2,402 |
|
Datasheet |
8 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 12 (2 x 6) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 105°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
12-8450-310CCONN IC DIP SOCKET 12POS GOLD |
1,779 |
|
Datasheet |
8 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 12 (2 x 6) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 105°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
12-8510-310CCONN IC DIP SOCKET 12POS GOLD |
4,690 |
|
Datasheet |
8 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 12 (2 x 6) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 105°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
23-0517-90CCONN SOCKET SIP 23POS GOLD |
1,115 |
|
Datasheet |
0517 | Bulk | Active | SIP | 23 (1 x 23) | Gold | 30.0µin (0.76µm) | Beryllium Copper | - | Through Hole, Right Angle | - | Solder | - | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
546-87-068-11-061135CONN SOCKET PGA 68POS GOLD |
2,504 |
|
Datasheet |
546 | Bulk | Active | PGA | 68 (11 x 11) | Gold | Flash | Beryllium Copper | 0.050" (1.27mm) | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Bronze |
|
|
546-87-068-11-061136CONN SOCKET PGA 68POS GOLD |
4,175 |
|
Datasheet |
546 | Bulk | Active | PGA | 68 (11 x 11) | Gold | Flash | Beryllium Copper | 0.050" (1.27mm) | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Bronze |
|
|
ICO-628-ZSGT.100" LOW PROFILE SCREW MACHINE |
4,363 |
|
Datasheet |
ICO | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyester, Glass Filled | Brass |
|
|
19-0511-10CONN SOCKET SIP 19POS TIN |
4,292 |
|
Datasheet |
511 | Bulk | Active | SIP | 19 (1 x 19) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 50.0µin (1.27µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Phosphor Bronze |
|
116-83-328-41-013101CONN IC DIP SOCKET 28POS GOLD |
3,369 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
116-83-428-41-013101CONN IC DIP SOCKET 28POS GOLD |
2,972 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 28 (2 x 14) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
116-83-648-41-008101CONN IC DIP SOCKET 48POS GOLD |
3,753 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
39-0511-10CONN SOCKET SIP 39POS TIN |
4,850 |
|
Datasheet |
511 | Bulk | Active | SIP | 39 (1 x 39) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 50.0µin (1.27µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Phosphor Bronze |
|
|
16-820-90TWRCONN IC DIP SOCKET 16POS TIN |
3,991 |
|
Datasheet |
Vertisockets™ 800 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6 | Phosphor Bronze |
|
|
16-822-90TWRCONN IC DIP SOCKET 16POS TIN |
4,407 |
|
Datasheet |
Vertisockets™ 800 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6 | Phosphor Bronze |
|
|
16-823-90TWRCONN IC DIP SOCKET 16POS TIN |
1,061 |
|
Datasheet |
Vertisockets™ 800 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6 | Phosphor Bronze |
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