Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































Apply All
Reset All
Result
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
10-7500-10

10-7500-10

CONN SOCKET SIP 10POS TIN

Aries Electronics

2,850
10-7500-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 10 (1 x 10) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Elevated Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
10-7550-10

10-7550-10

CONN SOCKET SIP 10POS TIN

Aries Electronics

1,881
10-7550-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 10 (1 x 10) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Elevated Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
10-7560-10

10-7560-10

CONN SOCKET SIP 10POS TIN

Aries Electronics

3,852
10-7560-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 10 (1 x 10) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Elevated Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
10-7600-10

10-7600-10

CONN SOCKET SIP 10POS TIN

Aries Electronics

4,620
10-7600-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 10 (1 x 10) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Elevated Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
10-7775-10

10-7775-10

CONN SOCKET SIP 10POS TIN

Aries Electronics

2,542
10-7775-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 10 (1 x 10) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Elevated Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
10-7860-10

10-7860-10

CONN SOCKET SIP 10POS TIN

Aries Electronics

1,850
10-7860-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 10 (1 x 10) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Elevated Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
10-7925-10

10-7925-10

CONN SOCKET SIP 10POS TIN

Aries Electronics

4,626
10-7925-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 10 (1 x 10) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Elevated Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
10-4810-90C

10-4810-90C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

4,582
10-4810-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
10-6810-90C

10-6810-90C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

4,030
10-6810-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
ICO-632-ZSGT

ICO-632-ZSGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

1,405
ICO-632-ZSGT

Datasheet

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 10.0µin (0.25µm) Polyester, Glass Filled Brass
116-83-432-41-013101

116-83-432-41-013101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

1,934
116-83-432-41-013101

Datasheet

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
HLS-0404-T-10

HLS-0404-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

4,457
HLS-0404-T-10

Datasheet

HLS Bulk Active SIP 16 (4 x 4) Tin - - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) - -55°C ~ 140°C - Thermoplastic -
550-80-068-10-061101

550-80-068-10-061101

PGA SOLDER TAIL

Preci-Dip

3,485
550-80-068-10-061101

Datasheet

550 Bulk Active PGA 68 (10 x 10) Tin - Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
840-AG11D

840-AG11D

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors

3,054
840-AG11D

Datasheet

800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 25.0µin (0.63µm) Copper Alloy 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 105°C - Polyester Copper Alloy
20-3501-21

20-3501-21

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,814
20-3501-21

Datasheet

501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
20-3501-31

20-3501-31

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

4,910
20-3501-31

Datasheet

501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
36-6501-20

36-6501-20

CONN IC DIP SOCKET 36POS TIN

Aries Electronics

4,107
36-6501-20

Datasheet

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
36-6501-30

36-6501-30

CONN IC DIP SOCKET 36POS TIN

Aries Electronics

4,808
36-6501-30

Datasheet

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
40-1518-11H

40-1518-11H

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

2,719
40-1518-11H

Datasheet

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
HLS-0213-T-30

HLS-0213-T-30

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

2,173
HLS-0213-T-30

Datasheet

HLS Tube Active SIP 26 (2 x 13) Tin - - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) - -55°C ~ 140°C - Thermoplastic -
Total 19086 Record«Prev1... 391392393394395396397398...955Next»

Frequently Asked Questions

IC Sockets Overview

Search Product

Search

Product Category

Products

Tel Us

Phone

My Acccout

User

OEM STOCK
OEM STOCK
[email protected]