| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
510-83-160-15-061101CONN SOCKET PGA 160POS GOLD |
4,805 |
|
Datasheet |
510 | Bulk | Active | PGA | 160 (15 x 15) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
510-83-160-13-001101CONN SOCKET PGA 160POS GOLD |
1,107 |
|
Datasheet |
510 | Bulk | Active | PGA | 160 (13 x 13) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
510-83-160-14-001101CONN SOCKET PGA 160POS GOLD |
2,121 |
|
Datasheet |
510 | Bulk | Active | PGA | 160 (14 x 14) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
HLS-0209-G-38.100" SCREW MACHINE SOCKET ARRAY |
2,284 |
|
Datasheet |
HLS | Tube | Active | SIP | 18 (2 x 9) | Gold | 30.0µin (0.76µm) | - | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 140°C | 10.0µin (0.25µm) | Thermoplastic | - |
|
|
510-83-160-16-081101CONN SOCKET PGA 160POS GOLD |
4,057 |
|
Datasheet |
510 | Bulk | Active | PGA | 160 (16 x 16) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
124-41-304-41-002000CONN IC SKT DBL |
4,432 |
|
Datasheet |
124 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
124-91-304-41-002000CONN IC SKT DBL |
4,989 |
|
Datasheet |
124 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
11-71000-10CONN SOCKET SIP 11POS TIN |
2,651 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 11 (1 x 11) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Phosphor Bronze |
|
|
11-7400-10CONN SOCKET SIP 11POS TIN |
1,289 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 11 (1 x 11) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Phosphor Bronze |
|
|
11-7587-10CONN SOCKET SIP 11POS TIN |
1,493 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 11 (1 x 11) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Phosphor Bronze |
|
|
08-6621-30CONN IC DIP SOCKET 8POS TIN |
2,599 |
|
Datasheet |
6621 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 8 (2 x 4) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole, Bottom Entry; Through Board | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Phosphor Bronze |
|
|
09-0501-30CONN SOCKET SIP 9POS TIN |
3,514 |
|
Datasheet |
501 | Bulk | Active | SIP | 9 (1 x 9) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Phosphor Bronze |
|
|
ICO-320-CGG.100" LOW PROFILE SCREW MACHINE |
4,774 |
|
Datasheet |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polyester, Glass Filled | Brass |
|
|
546-87-085-11-002135CONN SOCKET PGA 85POS GOLD |
4,328 |
|
Datasheet |
546 | Bulk | Active | PGA | 85 (11 x 11) | Gold | Flash | Beryllium Copper | 0.050" (1.27mm) | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Bronze |
|
|
30-9513-11CONN IC DIP SOCKET 30POS GOLD |
2,320 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 30 (2 x 15) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 105°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
13-0508-21CONN SOCKET SIP 13POS GOLD |
1,615 |
|
Datasheet |
508 | Bulk | Active | SIP | 13 (1 x 13) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Wire Wrap | - | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6 | Brass |
|
|
13-0508-31CONN SOCKET SIP 13POS GOLD |
4,117 |
|
Datasheet |
508 | Bulk | Active | SIP | 13 (1 x 13) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Wire Wrap | - | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6 | Brass |
|
|
18-3508-301CONN IC DIP SOCKET 18POS GOLD |
2,738 |
|
Datasheet |
508 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
14-6823-90CONN IC DIP SOCKET 14POS GOLD |
4,343 |
|
Datasheet |
Vertisockets™ 800 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 14 (2 x 7) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6 | Phosphor Bronze |
|
|
550-80-069-11-001101PGA SOLDER TAIL |
4,499 |
|
Datasheet |
550 | Bulk | Active | PGA | 69 (11 x 11) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
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