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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
28-6518-10E

28-6518-10E

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

4,191
28-6518-10E

Datasheet

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
12-6503-21

12-6503-21

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

3,302
12-6503-21

Datasheet

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
12-6503-31

12-6503-31

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

2,937
12-6503-31

Datasheet

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
APA-632-T-N

APA-632-T-N

ADAPTER PLUG

Samtec Inc.

3,781
APA-632-T-N

Datasheet

APA Tube Active - 32 (2 x 16) Tin - Phosphor Bronze 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - - Polybutylene Terephthalate (PBT), Glass Filled Phosphor Bronze
299-83-628-10-002101

299-83-628-10-002101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

1,092
299-83-628-10-002101

Datasheet

299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
510-83-148-15-062101

510-83-148-15-062101

CONN SOCKET PGA 148POS GOLD

Preci-Dip

1,118
510-83-148-15-062101

Datasheet

510 Bulk Active PGA 148 (15 x 15) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
APA-648-T-A1

APA-648-T-A1

ADAPTER PLUG

Samtec Inc.

1,316
APA-648-T-A1

Datasheet

APA Bulk Active - 48 (2 x 24) Tin - Phosphor Bronze 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - - Polybutylene Terephthalate (PBT), Glass Filled Phosphor Bronze
60-9513-10

60-9513-10

CONN IC DIP SOCKET 60POS GOLD

Aries Electronics

2,225
60-9513-10

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 60 (2 x 30) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
36-6513-11

36-6513-11

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

2,177
36-6513-11

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 105°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
ICA-316-WGG

ICA-316-WGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

3,211
ICA-316-WGG

Datasheet

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 30.0µin (0.76µm) Polyester, Glass Filled Brass
4-1437538-8

4-1437538-8

CONN IC DIP SOCKET 64POS GOLD

TE Connectivity AMP Connectors

4,525
4-1437538-8

Datasheet

800 Tube Obsolete DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 25.0µin (0.63µm) Copper Alloy 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) - -55°C ~ 105°C - Polyester -
4-1437531-9

4-1437531-9

CONN IC DIP SOCKET 16POS TIN

TE Connectivity AMP Connectors

3,994
4-1437531-9

Datasheet

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Tin - Copper Alloy 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 105°C - - Copper Alloy
ICO-632-ZLGT

ICO-632-ZLGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

1,393
ICO-632-ZLGT

Datasheet

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 10.0µin (0.25µm) Polyester, Glass Filled Brass
APH-1910-T-H

APH-1910-T-H

APH-1910-T-H

Samtec Inc.

1,982
APH-1910-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1510-T-H

APH-1510-T-H

APH-1510-T-H

Samtec Inc.

4,735
APH-1510-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1810-T-H

APH-1810-T-H

APH-1810-T-H

Samtec Inc.

4,729
APH-1810-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0410-T-H

APH-0410-T-H

APH-0410-T-H

Samtec Inc.

4,441
APH-0410-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0810-T-H

APH-0810-T-H

APH-0810-T-H

Samtec Inc.

3,016
APH-0810-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
510-83-149-15-003101

510-83-149-15-003101

CONN SOCKET PGA 149POS GOLD

Preci-Dip

4,760
510-83-149-15-003101

Datasheet

510 Bulk Active PGA 149 (15 x 15) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
510-83-149-15-061101

510-83-149-15-061101

CONN SOCKET PGA 149POS GOLD

Preci-Dip

1,753
510-83-149-15-061101

Datasheet

510 Bulk Active PGA 149 (15 x 15) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
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