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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
22-4518-01

22-4518-01

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

3,370
22-4518-01

Datasheet

518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
HLS-0309-T-10

HLS-0309-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

2,844
HLS-0309-T-10

Datasheet

HLS Tube Active SIP 27 (3 x 9) Tin - - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) - -55°C ~ 140°C - Thermoplastic -
ICA-316-ZWGG

ICA-316-ZWGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

3,109
ICA-316-ZWGG

Datasheet

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 30.0µin (0.76µm) Polyester, Glass Filled Brass
HLS-0404-G-2

HLS-0404-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

2,017
HLS-0404-G-2

Datasheet

HLS Bulk Active SIP 16 (4 x 4) Gold 30.0µin (0.76µm) - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 140°C 10.0µin (0.25µm) Thermoplastic -
HLS-0408-T-2

HLS-0408-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

3,755
HLS-0408-T-2

Datasheet

HLS Bulk Active SIP 32 (4 x 8) Tin - - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) - -55°C ~ 140°C - Thermoplastic -
10-6621-30

10-6621-30

CONN IC DIP SOCKET 10POS TIN

Aries Electronics

3,727
10-6621-30

Datasheet

6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
24-3518-11H

24-3518-11H

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,372
24-3518-11H

Datasheet

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
28-6501-30

28-6501-30

CONN IC DIP SOCKET 28POS TIN

Aries Electronics

3,676
28-6501-30

Datasheet

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
ICA-320-AGG

ICA-320-AGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

2,266
ICA-320-AGG

Datasheet

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 30.0µin (0.76µm) Polyester, Glass Filled Brass
ICO-320-AGG

ICO-320-AGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

3,301
ICO-320-AGG

Datasheet

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 30.0µin (0.76µm) Polyester, Glass Filled Brass
510-83-179-18-001101

510-83-179-18-001101

CONN SOCKET PGA 179POS GOLD

Preci-Dip

4,707
510-83-179-18-001101

Datasheet

510 Bulk Active PGA 179 (18 x 18) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
510-83-179-18-111101

510-83-179-18-111101

CONN SOCKET PGA 179POS GOLD

Preci-Dip

4,635
510-83-179-18-111101

Datasheet

510 Bulk Active PGA 179 (18 x 18) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
510-83-179-18-112101

510-83-179-18-112101

CONN SOCKET PGA 179POS GOLD

Preci-Dip

4,054
510-83-179-18-112101

Datasheet

510 Bulk Active PGA 179 (18 x 18) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
510-83-179-18-113101

510-83-179-18-113101

CONN SOCKET PGA 179POS GOLD

Preci-Dip

1,367
510-83-179-18-113101

Datasheet

510 Bulk Active PGA 179 (18 x 18) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
510-83-174-17-061101

510-83-174-17-061101

CONN SOCKET PGA 174POS GOLD

Preci-Dip

1,673
510-83-174-17-061101

Datasheet

510 Bulk Active PGA 174 (17 x 17) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
510-83-174-17-081101

510-83-174-17-081101

CONN SOCKET PGA 174POS GOLD

Preci-Dip

3,264
510-83-174-17-081101

Datasheet

510 Bulk Active PGA 174 (17 x 17) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
10-3503-21

10-3503-21

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,301
10-3503-21

Datasheet

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
10-3503-31

10-3503-31

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

4,713
10-3503-31

Datasheet

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
HLS-0120-G-30

HLS-0120-G-30

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

3,665
HLS-0120-G-30

Datasheet

HLS Tube Active SIP 20 (1 x 20) Gold 30.0µin (0.76µm) - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 140°C 10.0µin (0.25µm) Thermoplastic -
510-83-155-16-093101

510-83-155-16-093101

CONN SOCKET PGA 155POS GOLD

Preci-Dip

3,185
510-83-155-16-093101

Datasheet

510 Bulk Active PGA 155 (16 x 16) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
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