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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
42-6513-11H

42-6513-11H

CONN IC DIP SOCKET 42POS GOLD

Aries Electronics

3,580
42-6513-11H

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 105°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
20-820-90

20-820-90

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,846
20-820-90

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Phosphor Bronze 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 105°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6 Phosphor Bronze
20-820-90TWR

20-820-90TWR

CONN IC DIP SOCKET 20POS TIN

Aries Electronics

2,489
20-820-90TWR

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6 Phosphor Bronze
20-822-90

20-822-90

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,909
20-822-90

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Phosphor Bronze 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 105°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6 Phosphor Bronze
24-6823-90T

24-6823-90T

CONN IC DIP SOCKET 24POS TIN

Aries Electronics

2,076
24-6823-90T

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6 Phosphor Bronze
20-810-90T

20-810-90T

CONN IC DIP SOCKET 20POS TIN

Aries Electronics

4,656
20-810-90T

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6 Phosphor Bronze
22-4820-90C

22-4820-90C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

4,050
22-4820-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
22-6822-90C

22-6822-90C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

1,283
22-6822-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
22-6823-90C

22-6823-90C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

1,264
22-6823-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
714-43-216-31-018000

714-43-216-31-018000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

1,473
714-43-216-31-018000

Datasheet

714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 30.0µin (0.76µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
16-6810-90T

16-6810-90T

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

2,573
16-6810-90T

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6 Phosphor Bronze
16-6823-90

16-6823-90

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3,447
16-6823-90

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Phosphor Bronze 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6 Phosphor Bronze
16-2822-90C

16-2822-90C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

4,515
16-2822-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
16-2823-90C

16-2823-90C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3,236
16-2823-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
16-4820-90C

16-4820-90C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

1,637
16-4820-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
16-4822-90C

16-4822-90C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

1,476
16-4822-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
16-6820-90C

16-6820-90C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

1,472
16-6820-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
16-6822-90C

16-6822-90C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

1,929
16-6822-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
16-6823-90C

16-6823-90C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

4,231
16-6823-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
28-0508-20

28-0508-20

CONN SOCKET SIP 28POS GOLD

Aries Electronics

2,370
28-0508-20

Datasheet

508 Bulk Active SIP 28 (1 x 28) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Wire Wrap - Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6 Brass
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