Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































Apply All
Reset All
Result
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
APH-0606-G-R

APH-0606-G-R

APH-0606-G-R

Samtec Inc.

1,685
APH-0606-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1106-G-R

APH-1106-G-R

APH-1106-G-R

Samtec Inc.

4,732
APH-1106-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1606-G-R

APH-1606-G-R

APH-1606-G-R

Samtec Inc.

1,603
APH-1606-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1306-G-R

APH-1306-G-R

APH-1306-G-R

Samtec Inc.

4,822
APH-1306-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0806-G-R

APH-0806-G-R

APH-0806-G-R

Samtec Inc.

2,301
APH-0806-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1206-G-R

APH-1206-G-R

APH-1206-G-R

Samtec Inc.

4,040
APH-1206-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0706-G-R

APH-0706-G-R

APH-0706-G-R

Samtec Inc.

4,295
APH-0706-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
HLS-0307-G-12

HLS-0307-G-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

4,357
HLS-0307-G-12

Datasheet

HLS Tube Active SIP 21 (3 x 7) Gold 30.0µin (0.76µm) - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 140°C 10.0µin (0.25µm) Thermoplastic -
1735315-4

1735315-4

CONN SOCKET PGA ZIF 939POS GOLD

TE Connectivity AMP Connectors

3,898
1735315-4

Datasheet

- Tray Obsolete PGA, ZIF (ZIP) 939 (31 x 31) Gold 15.0µin (0.38µm) Copper Alloy 0.050" (1.27mm) Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold - 15.0µin (0.38µm) Thermoplastic Copper Alloy
13-0501-20

13-0501-20

CONN SOCKET SIP 13POS TIN

Aries Electronics

1,423
13-0501-20

Datasheet

501 Bulk Active SIP 13 (1 x 13) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole - Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
13-0501-30

13-0501-30

CONN SOCKET SIP 13POS TIN

Aries Electronics

2,419
13-0501-30

Datasheet

501 Bulk Active SIP 13 (1 x 13) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole - Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
40-3513-10H

40-3513-10H

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

2,826
40-3513-10H

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
ICA-632-ZWGT-3

ICA-632-ZWGT-3

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

1,875
ICA-632-ZWGT-3

Datasheet

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 10.0µin (0.25µm) Polyester, Glass Filled Brass
HLS-0120-G-38

HLS-0120-G-38

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

3,896
HLS-0120-G-38

Datasheet

HLS Tube Active SIP 20 (1 x 20) Gold 30.0µin (0.76µm) - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 140°C 10.0µin (0.25µm) Thermoplastic -
210-47-306-41-001000

210-47-306-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

4,857
210-47-306-41-001000

Datasheet

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
117-43-448-41-005000

117-43-448-41-005000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.

2,855
117-43-448-41-005000

Datasheet

117 Tube Active DIP, 0.4" (10.16mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper 0.070" (1.78mm) Through Hole Open Frame Solder 0.070" (1.78mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
14-0501-21

14-0501-21

CONN SOCKET SIP 14POS GOLD

Aries Electronics

3,595
14-0501-21

Datasheet

501 Bulk Active SIP 14 (1 x 14) Gold 10.0µin (0.25µm) Phosphor Bronze 0.100" (2.54mm) Through Hole - Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
24-4518-01

24-4518-01

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,408
24-4518-01

Datasheet

518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
20-6820-90C

20-6820-90C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

4,253
20-6820-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
20-6822-90C

20-6822-90C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

1,042
20-6822-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
Total 19086 Record«Prev1... 432433434435436437438439...955Next»

Frequently Asked Questions

IC Sockets Overview

Search Product

Search

Product Category

Products

Tel Us

Phone

My Acccout

User

OEM STOCK
OEM STOCK
[email protected]