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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
16-1508-21

16-1508-21

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3,330
16-1508-21

Datasheet

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6 Brass
16-1508-31

16-1508-31

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3,685
16-1508-31

Datasheet

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6 Brass
38-6501-20

38-6501-20

CONN IC DIP SOCKET 38POS TIN

Aries Electronics

3,433
38-6501-20

Datasheet

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 38 (2 x 19) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
HLS-0312-T-10

HLS-0312-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

1,110
HLS-0312-T-10

Datasheet

HLS Tube Active SIP 36 (3 x 12) Tin - - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) - -55°C ~ 140°C - Thermoplastic -
346-93-141-41-013000

346-93-141-41-013000

CONN SOCKET SIP 41POS GOLD

Mill-Max Manufacturing Corp.

2,251
346-93-141-41-013000

Datasheet

346 Bulk Active SIP 41 (1 x 41) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
346-43-141-41-013000

346-43-141-41-013000

CONN SOCKET SIP 41POS GOLD

Mill-Max Manufacturing Corp.

2,925
346-43-141-41-013000

Datasheet

346 Bulk Active SIP 41 (1 x 41) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Press-Fit 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
ICA-318-JGG

ICA-318-JGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

2,874
ICA-318-JGG

Datasheet

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 30.0µin (0.76µm) Polyester, Glass Filled Brass
31-0508-20

31-0508-20

CONN SOCKET SIP 31POS GOLD

Aries Electronics

4,595
31-0508-20

Datasheet

508 Bulk Active SIP 31 (1 x 31) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Wire Wrap - Gold -55°C ~ 105°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6 Brass
31-0508-30

31-0508-30

CONN SOCKET SIP 31POS GOLD

Aries Electronics

1,352
31-0508-30

Datasheet

508 Bulk Active SIP 31 (1 x 31) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Wire Wrap - Gold -55°C ~ 105°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6 Brass
24-0508-20

24-0508-20

CONN SOCKET SIP 24POS GOLD

Aries Electronics

3,977
24-0508-20

Datasheet

508 Bulk Active SIP 24 (1 x 24) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Wire Wrap - Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6 Brass
24-0508-30

24-0508-30

CONN SOCKET SIP 24POS GOLD

Aries Electronics

2,828
24-0508-30

Datasheet

508 Bulk Active SIP 24 (1 x 24) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Wire Wrap - Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6 Brass
24-1508-20

24-1508-20

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

1,212
24-1508-20

Datasheet

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6 Brass
24-1508-30

24-1508-30

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

4,574
24-1508-30

Datasheet

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6 Brass
714-43-132-31-018000

714-43-132-31-018000

CONN SOCKET SIP 32POS GOLD

Mill-Max Manufacturing Corp.

2,235
714-43-132-31-018000

Datasheet

714 Tube Active SIP 32 (1 x 32) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 30.0µin (0.76µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
210-93-306-41-001000

210-93-306-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,452
210-93-306-41-001000

Datasheet

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
714-43-218-31-018000

714-43-218-31-018000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

2,556
714-43-218-31-018000

Datasheet

714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 30.0µin (0.76µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
APH-1820-T-R

APH-1820-T-R

APH-1820-T-R

Samtec Inc.

2,425
APH-1820-T-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0920-T-R

APH-0920-T-R

APH-0920-T-R

Samtec Inc.

3,456
APH-0920-T-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1420-T-R

APH-1420-T-R

APH-1420-T-R

Samtec Inc.

1,005
APH-1420-T-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0520-T-R

APH-0520-T-R

APH-0520-T-R

Samtec Inc.

1,657
APH-0520-T-R

Datasheet

* - Active - - - - - - - - - - - - - - -
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