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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
24-6501-21

24-6501-21

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

1,977
24-6501-21

Datasheet

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
116-43-304-61-006000

116-43-304-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,845
116-43-304-61-006000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
116-93-304-61-006000

116-93-304-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,297
116-93-304-61-006000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
ICA-632-ZSGG-L

ICA-632-ZSGG-L

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

2,950
ICA-632-ZSGG-L

Datasheet

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 30.0µin (0.76µm) Polyester, Glass Filled Brass
APH-1816-T-R

APH-1816-T-R

APH-1816-T-R

Samtec Inc.

1,860
APH-1816-T-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1916-T-R

APH-1916-T-R

APH-1916-T-R

Samtec Inc.

3,449
APH-1916-T-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1516-T-R

APH-1516-T-R

APH-1516-T-R

Samtec Inc.

2,667
APH-1516-T-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0216-T-R

APH-0216-T-R

APH-0216-T-R

Samtec Inc.

1,990
APH-0216-T-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1316-T-R

APH-1316-T-R

APH-1316-T-R

Samtec Inc.

4,947
APH-1316-T-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1216-T-R

APH-1216-T-R

APH-1216-T-R

Samtec Inc.

1,767
APH-1216-T-R

Datasheet

* - Active - - - - - - - - - - - - - - -
110-43-310-41-001000

110-43-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,994
110-43-310-41-001000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
ICA-628-ZAGG

ICA-628-ZAGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

2,669
ICA-628-ZAGG

Datasheet

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 30.0µin (0.76µm) Polyester, Glass Filled Brass
ICO-628-ZAGG

ICO-628-ZAGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

1,362
ICO-628-ZAGG

Datasheet

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 30.0µin (0.76µm) Polyester, Glass Filled Brass
36-6513-11H

36-6513-11H

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

1,807
36-6513-11H

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 105°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
32-0508-20

32-0508-20

CONN SOCKET SIP 32POS GOLD

Aries Electronics

3,947
32-0508-20

Datasheet

508 Bulk Active SIP 32 (1 x 32) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Wire Wrap - Gold -55°C ~ 105°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6 Brass
32-0508-30

32-0508-30

CONN SOCKET SIP 32POS GOLD

Aries Electronics

1,314
32-0508-30

Datasheet

508 Bulk Active SIP 32 (1 x 32) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Wire Wrap - Gold -55°C ~ 105°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6 Brass
32-1508-20

32-1508-20

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

1,728
32-1508-20

Datasheet

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6 Brass
32-1508-30

32-1508-30

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,702
32-1508-30

Datasheet

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6 Brass
210-99-314-41-001000

210-99-314-41-001000

CONN IC DIP SOCKET 14POS TINLEAD

Mill-Max Manufacturing Corp.

4,325
210-99-314-41-001000

Datasheet

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin-Lead 100.0µin (2.54µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
210-44-314-41-001000

210-44-314-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

1,518
210-44-314-41-001000

Datasheet

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin 100.0µin (2.54µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
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