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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
24-3554-10

24-3554-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

2,851
24-3554-10

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
116-93-210-41-003000

116-93-210-41-003000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

1,544
116-93-210-41-003000

Datasheet

116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
116-43-210-41-003000

116-43-210-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,167
116-43-210-41-003000

Datasheet

116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
111-47-322-41-001000

111-47-322-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

1,202
111-47-322-41-001000

Datasheet

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
111-47-422-41-001000

111-47-422-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

2,508
111-47-422-41-001000

Datasheet

111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
32-3503-20

32-3503-20

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,938
32-3503-20

Datasheet

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
32-3503-30

32-3503-30

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,165
32-3503-30

Datasheet

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
605-41-308-11-480000

605-41-308-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

3,012
605-41-308-11-480000

Datasheet

605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
605-91-308-11-480000

605-91-308-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

4,565
605-91-308-11-480000

Datasheet

605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
ICA-422-AGG

ICA-422-AGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

4,789
ICA-422-AGG

Datasheet

ICA Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 30.0µin (0.76µm) Polyester, Glass Filled Brass
HLS-0214-G-11

HLS-0214-G-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

1,250
HLS-0214-G-11

Datasheet

HLS Tube Active SIP 28 (2 x 14) Gold 30.0µin (0.76µm) - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 140°C 10.0µin (0.25µm) Thermoplastic -
110-47-322-41-105000

110-47-322-41-105000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

2,884
110-47-322-41-105000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
110-47-422-41-105000

110-47-422-41-105000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

1,672
110-47-422-41-105000

Datasheet

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
HLS-0320-S-2

HLS-0320-S-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

2,706
HLS-0320-S-2

Datasheet

HLS Tube Active SIP 60 (3 x 20) Gold - - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) - -55°C ~ 140°C - Thermoplastic -
126-93-306-41-002000

126-93-306-41-002000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

3,516
126-93-306-41-002000

Datasheet

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
126-43-306-41-002000

126-43-306-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,464
126-43-306-41-002000

Datasheet

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
32-820-90C

32-820-90C

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2,772
32-820-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
317-91-112-41-005000

317-91-112-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

3,468
317-91-112-41-005000

Datasheet

317 Bulk Active SIP 12 (1 x 12) Gold 10.0µin (0.25µm) Beryllium Copper 0.070" (1.78mm) Through Hole - Solder 0.070" (1.78mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
HLS-0120-G-18

HLS-0120-G-18

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

4,026
HLS-0120-G-18

Datasheet

HLS Tube Active SIP 20 (1 x 20) Gold 30.0µin (0.76µm) - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 140°C 10.0µin (0.25µm) Thermoplastic -
116-93-308-41-007000

116-93-308-41-007000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

4,727
116-93-308-41-007000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
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