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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
APH-1606-G-H

APH-1606-G-H

APH-1606-G-H

Samtec Inc.

4,412
APH-1606-G-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1206-G-H

APH-1206-G-H

APH-1206-G-H

Samtec Inc.

3,278
APH-1206-G-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0406-G-H

APH-0406-G-H

APH-0406-G-H

Samtec Inc.

2,152
APH-0406-G-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1706-G-H

APH-1706-G-H

APH-1706-G-H

Samtec Inc.

3,930
APH-1706-G-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1806-G-H

APH-1806-G-H

APH-1806-G-H

Samtec Inc.

4,192
APH-1806-G-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0706-G-H

APH-0706-G-H

APH-0706-G-H

Samtec Inc.

4,172
APH-0706-G-H

Datasheet

* - Active - - - - - - - - - - - - - - -
HLS-0215-G-10

HLS-0215-G-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

3,283
HLS-0215-G-10

Datasheet

HLS Tube Active SIP 30 (2 x 15) Gold 30.0µin (0.76µm) - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 140°C 10.0µin (0.25µm) Thermoplastic -
18-6810-90

18-6810-90

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,900
18-6810-90

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Phosphor Bronze 0.100" (2.54mm) Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6 Phosphor Bronze
22-81150-610C

22-81150-610C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

3,653
22-81150-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold -55°C ~ 105°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
22-81250-310C

22-81250-310C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

4,564
22-81250-310C

Datasheet

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold -55°C ~ 105°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
22-81250-610C

22-81250-610C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

2,863
22-81250-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold -55°C ~ 105°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
22-8500-610C

22-8500-610C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

3,625
22-8500-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold -55°C ~ 105°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
22-8600-610C

22-8600-610C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

4,533
22-8600-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold -55°C ~ 105°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
22-8850-610C

22-8850-610C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

2,794
22-8850-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold -55°C ~ 105°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
605-93-310-11-480000

605-93-310-11-480000

SOCKET CARRIER LOWPRO .300 10POS

Mill-Max Manufacturing Corp.

3,369
605-93-310-11-480000

Datasheet

605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
605-43-310-11-480000

605-43-310-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

3,462
605-43-310-11-480000

Datasheet

605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
110-91-428-41-001000

110-91-428-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

2,206
110-91-428-41-001000

Datasheet

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
110-41-428-41-001000

110-41-428-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,644
110-41-428-41-001000

Datasheet

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
116-93-310-41-008000

116-93-310-41-008000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

2,603
116-93-310-41-008000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
126-93-310-41-001000

126-93-310-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

1,084
126-93-310-41-001000

Datasheet

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
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