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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
APH-0908-G-H

APH-0908-G-H

APH-0908-G-H

Samtec Inc.

1,469
APH-0908-G-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1408-G-H

APH-1408-G-H

APH-1408-G-H

Samtec Inc.

1,896
APH-1408-G-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1808-G-H

APH-1808-G-H

APH-1808-G-H

Samtec Inc.

4,075
APH-1808-G-H

Datasheet

* - Active - - - - - - - - - - - - - - -
116-47-210-41-001000

116-47-210-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

1,687
116-47-210-41-001000

Datasheet

116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
32-3513-11H

32-3513-11H

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,208
32-3513-11H

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 105°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
28-6503-20

28-6503-20

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

1,982
28-6503-20

Datasheet

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
28-6503-30

28-6503-30

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,285
28-6503-30

Datasheet

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
116-93-210-41-008000

116-93-210-41-008000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

1,478
116-93-210-41-008000

Datasheet

116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
116-43-210-41-008000

116-43-210-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,537
116-43-210-41-008000

Datasheet

116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
510-83-236-17-061101

510-83-236-17-061101

CONN SOCKET PGA 236POS GOLD

Preci-Dip

1,253
510-83-236-17-061101

Datasheet

510 Bulk Active PGA 236 (17 x 17) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
510-83-236-17-062101

510-83-236-17-062101

CONN SOCKET PGA 236POS GOLD

Preci-Dip

3,655
510-83-236-17-062101

Datasheet

510 Bulk Active PGA 236 (17 x 17) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
110-43-304-61-001000

110-43-304-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,516
110-43-304-61-001000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
104-11-210-41-770000

104-11-210-41-770000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,614
104-11-210-41-770000

Datasheet

104 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
121-11-310-41-001000

121-11-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,522
121-11-310-41-001000

Datasheet

121 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) - - Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
110-43-316-41-605000

110-43-316-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,771
110-43-316-41-605000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
123-91-306-41-001000

123-91-306-41-001000

SOCKET IC OPEN 3 LVL .300 6POS

Mill-Max Manufacturing Corp.

3,289
123-91-306-41-001000

Datasheet

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
123-41-306-41-001000

123-41-306-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,134
123-41-306-41-001000

Datasheet

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
HLS-0510-S-2

HLS-0510-S-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

4,800
HLS-0510-S-2

Datasheet

HLS Bulk Active SIP 50 (5 x 10) Gold - - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) - -55°C ~ 140°C - Thermoplastic -
25-71000-10

25-71000-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

1,602
25-71000-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Elevated Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
25-71219-10

25-71219-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

4,609
25-71219-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Elevated Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
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