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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
APH-0722-T-T

APH-0722-T-T

APH-0722-T-T

Samtec Inc.

1,556
APH-0722-T-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1622-T-T

APH-1622-T-T

APH-1622-T-T

Samtec Inc.

3,334
APH-1622-T-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0322-T-T

APH-0322-T-T

APH-0322-T-T

Samtec Inc.

3,003
APH-0322-T-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1722-T-T

APH-1722-T-T

APH-1722-T-T

Samtec Inc.

4,015
APH-1722-T-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1222-T-T

APH-1222-T-T

APH-1222-T-T

Samtec Inc.

2,068
APH-1222-T-T

Datasheet

* - Active - - - - - - - - - - - - - - -
124-41-310-41-002000

124-41-310-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,292
124-41-310-41-002000

Datasheet

124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
124-91-310-41-002000

124-91-310-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,258
124-91-310-41-002000

Datasheet

124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
122-13-310-41-001000

122-13-310-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

3,415
122-13-310-41-001000

Datasheet

122 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
110-11-624-41-001000

110-11-624-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

2,300
110-11-624-41-001000

Datasheet

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Thermoplastic Brass Alloy
110-11-324-41-001000

110-11-324-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,255
110-11-324-41-001000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
110-11-424-41-001000

110-11-424-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,376
110-11-424-41-001000

Datasheet

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
40-1508-20

40-1508-20

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

1,117
40-1508-20

Datasheet

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6 Brass
40-1508-30

40-1508-30

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

4,455
40-1508-30

Datasheet

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6 Brass
605-93-314-11-480000

605-93-314-11-480000

SOCKET CARRIER LOWPRO .300 14POS

Mill-Max Manufacturing Corp.

1,925
605-93-314-11-480000

Datasheet

605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
605-43-314-11-480000

605-43-314-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

3,262
605-43-314-11-480000

Datasheet

605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
22-0501-30

22-0501-30

CONN SOCKET SIP 22POS TIN

Aries Electronics

1,534
22-0501-30

Datasheet

501 Bulk Active SIP 22 (1 x 22) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole - Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
317-93-116-41-005000

317-93-116-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

4,884
317-93-116-41-005000

Datasheet

317 Tube Active SIP 16 (1 x 16) Gold 30.0µin (0.76µm) Beryllium Copper 0.070" (1.78mm) Through Hole - Solder 0.070" (1.78mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
123-11-310-41-001000

123-11-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,820
123-11-310-41-001000

Datasheet

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) - - Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
110-41-632-41-105000

110-41-632-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,449
110-41-632-41-105000

Datasheet

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
110-91-632-41-105000

110-91-632-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,783
110-91-632-41-105000

Datasheet

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
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