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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
110-93-428-41-105000

110-93-428-41-105000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

3,342
110-93-428-41-105000

Datasheet

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
110-93-628-41-105000

110-93-628-41-105000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

2,419
110-93-628-41-105000

Datasheet

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
110-43-428-41-105000

110-43-428-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,068
110-43-428-41-105000

Datasheet

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
110-43-628-41-105000

110-43-628-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,085
110-43-628-41-105000

Datasheet

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
APH-0922-T-R

APH-0922-T-R

APH-0922-T-R

Samtec Inc.

1,221
APH-0922-T-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1922-T-R

APH-1922-T-R

APH-1922-T-R

Samtec Inc.

1,852
APH-1922-T-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0222-T-R

APH-0222-T-R

APH-0222-T-R

Samtec Inc.

4,595
APH-0222-T-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1722-T-R

APH-1722-T-R

APH-1722-T-R

Samtec Inc.

4,420
APH-1722-T-R

Datasheet

* - Active - - - - - - - - - - - - - - -
116-93-316-41-008000

116-93-316-41-008000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

3,316
116-93-316-41-008000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
116-43-316-41-008000

116-43-316-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,321
116-43-316-41-008000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
HLS-2020-T-22

HLS-2020-T-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

4,658
HLS-2020-T-22

Datasheet

HLS Bulk Active SIP 400 (20 x 20) Tin - - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) - -55°C ~ 140°C - Thermoplastic -
111-47-650-41-001000

111-47-650-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

3,328
111-47-650-41-001000

Datasheet

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
317-43-119-41-005000

317-43-119-41-005000

CONN SKT STRIP

Mill-Max Manufacturing Corp.

1,664
317-43-119-41-005000

Datasheet

317 Bulk Active SIP 19 (1 x 19) Gold 30.0µin (0.76µm) Beryllium Copper 0.070" (1.78mm) Through Hole - Solder 0.070" (1.78mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
612-41-316-41-001000

612-41-316-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

1,340
612-41-316-41-001000

Datasheet

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
612-91-316-41-001000

612-91-316-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

4,705
612-91-316-41-001000

Datasheet

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
110-93-632-41-605000

110-93-632-41-605000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

2,506
110-93-632-41-605000

Datasheet

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
110-43-632-41-605000

110-43-632-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,415
110-43-632-41-605000

Datasheet

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
32-6551-10

32-6551-10

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

2,559
32-6551-10

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
32-3554-10

32-3554-10

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

3,548
32-3554-10

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
44-6556-10

44-6556-10

CONN IC DIP SOCKET 44POS GOLD

Aries Electronics

1,065
44-6556-10

Datasheet

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 44 (2 x 22) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Brass
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