| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
126-93-316-41-001000CONN IC DIP SOCKET 16POS GOLD |
2,675 |
|
Datasheet |
126 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
126-43-316-41-001000CONN IC SKT DBL |
4,435 |
|
Datasheet |
126 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
APO-640-T-R.100" LOW PROFILE SCREW MACHINE |
1,151 |
|
Datasheet |
APO | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | - | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
|
|
612-43-210-41-004000SKT CARRIER SOLDRTL |
3,448 |
|
Datasheet |
612 | Tube | Active | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
612-93-210-41-004000SKT CARRIER SOLDRTL |
4,791 |
|
Datasheet |
612 | Tube | Active | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
14-3508-311CONN IC DIP SOCKET 14POS GOLD |
4,609 |
|
Datasheet |
508 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
28-6501-21CONN IC DIP SOCKET 28POS GOLD |
3,671 |
|
Datasheet |
501 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Phosphor Bronze |
|
|
28-6501-31CONN IC DIP SOCKET 28POS GOLD |
3,532 |
|
Datasheet |
501 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Phosphor Bronze |
|
|
123-91-322-41-001000SOCKET IC OPEN 3 LVL .300 22POS |
1,646 |
|
Datasheet |
123 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
123-91-422-41-001000SOCKET IC OPEN 3 LVL .400 22POS |
4,635 |
|
Datasheet |
123 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
123-41-322-41-001000CONN IC SKT DBL |
1,236 |
|
Datasheet |
123 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
123-41-422-41-001000CONN IC SKT DBL |
3,276 |
|
Datasheet |
123 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
23-0503-21CONN SOCKET SIP 23POS GOLD |
3,673 |
|
Datasheet |
0503 | Bulk | Active | SIP | 23 (1 x 23) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Gold | - | 10.0µin (0.25µm) | Polyamide (PA), Nylon, Glass Filled | Brass |
|
|
111-93-432-41-001000CONN IC DIP SOCKET 32POS GOLD |
3,535 |
|
Datasheet |
111 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 32 (2 x 16) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
111-43-432-41-001000CONN IC SKT DBL |
1,659 |
|
Datasheet |
111 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 32 (2 x 16) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
115-44-650-41-003000CONN IC SKT DBL |
4,690 |
|
Datasheet |
115 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 50 (2 x 25) | Tin | 100.0µin (2.54µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
612-11-210-41-001000SKT CARRIER SOLDRTL |
1,475 |
|
Datasheet |
612 | Tube | Active | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5) | - | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | - | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
110-47-952-41-001000STANDRD SOLDRTL |
4,305 |
|
Datasheet |
110 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 52 (2 x 26) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
HLS-0407-G-10.100" SCREW MACHINE SOCKET ARRAY |
4,099 |
|
Datasheet |
HLS | Bulk | Active | SIP | 28 (4 x 7) | Gold | 30.0µin (0.76µm) | - | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 140°C | 10.0µin (0.25µm) | Thermoplastic | - |
|
|
68-PGM11033-10HCONN SOCKET PGA GOLD |
2,582 |
|
Datasheet |
PGM | Bulk | Active | PGA | - | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
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