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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
614-91-628-41-001000

614-91-628-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,307
614-91-628-41-001000

Datasheet

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
28-0501-21

28-0501-21

CONN SOCKET SIP 28POS GOLD

Aries Electronics

4,462
28-0501-21

Datasheet

501 Bulk Active SIP 28 (1 x 28) Gold 10.0µin (0.25µm) Phosphor Bronze 0.100" (2.54mm) Through Hole - Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
28-0501-31

28-0501-31

CONN SOCKET SIP 28POS GOLD

Aries Electronics

2,391
28-0501-31

Datasheet

501 Bulk Active SIP 28 (1 x 28) Gold 10.0µin (0.25µm) Phosphor Bronze 0.100" (2.54mm) Through Hole - Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
16-3508-21

16-3508-21

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

1,568
16-3508-21

Datasheet

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
16-3508-31

16-3508-31

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3,666
16-3508-31

Datasheet

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
25-0508-31

25-0508-31

CONN SOCKET SIP 25POS GOLD

Aries Electronics

4,630
25-0508-31

Datasheet

508 Bulk Active SIP 25 (1 x 25) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Wire Wrap - Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6 Brass
40-6822-90C

40-6822-90C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3,151
40-6822-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
40-6823-90C

40-6823-90C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

4,863
40-6823-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
124-93-320-41-002000

124-93-320-41-002000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

1,866
124-93-320-41-002000

Datasheet

124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
124-93-420-41-002000

124-93-420-41-002000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

1,742
124-93-420-41-002000

Datasheet

124 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
124-43-320-41-002000

124-43-320-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,110
124-43-320-41-002000

Datasheet

124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
124-43-420-41-002000

124-43-420-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,324
124-43-420-41-002000

Datasheet

124 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
111-47-950-41-001000

111-47-950-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

2,289
111-47-950-41-001000

Datasheet

111 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
110-47-964-41-105000

110-47-964-41-105000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

1,477
110-47-964-41-105000

Datasheet

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold Flash Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
30-81250-610C

30-81250-610C

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

3,518
30-81250-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold -55°C ~ 105°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
30-8563-610C

30-8563-610C

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

4,158
30-8563-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold -55°C ~ 105°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
30-8940-310C

30-8940-310C

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

1,236
30-8940-310C

Datasheet

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold -55°C ~ 105°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
30-8950-610C

30-8950-610C

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

4,708
30-8950-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold -55°C ~ 105°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
321-13-120-41-001000

321-13-120-41-001000

SOCKET 1 LEVEL WRAPOST SIP 20POS

Mill-Max Manufacturing Corp.

2,831
321-13-120-41-001000

Datasheet

321 Tube Active SIP 20 (1 x 20) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
APH-1834-T-R

APH-1834-T-R

APH-1834-T-R

Samtec Inc.

3,031
APH-1834-T-R

Datasheet

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