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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
22-0503-21

22-0503-21

CONN SOCKET SIP 22POS GOLD

Aries Electronics

4,554
22-0503-21

Datasheet

0503 Bulk Active SIP 22 (1 x 22) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Wire Wrap 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyamide (PA), Nylon, Glass Filled Brass
22-0503-31

22-0503-31

CONN SOCKET SIP 22POS GOLD

Aries Electronics

2,414
22-0503-31

Datasheet

0503 Bulk Active SIP 22 (1 x 22) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Wire Wrap 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyamide (PA), Nylon, Glass Filled Brass
16-3508-211

16-3508-211

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

1,409
16-3508-211

Datasheet

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
16-3508-311

16-3508-311

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,805
16-3508-311

Datasheet

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
116-47-652-41-006000

116-47-652-41-006000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

4,795
116-47-652-41-006000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
HLS-0610-T-2

HLS-0610-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

2,561
HLS-0610-T-2

Datasheet

HLS Bulk Active SIP 60 (6 x 10) Tin - - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) - -55°C ~ 140°C - Thermoplastic -
APH-1814-G-R

APH-1814-G-R

APH-1814-G-R

Samtec Inc.

1,420
APH-1814-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0514-G-R

APH-0514-G-R

APH-0514-G-R

Samtec Inc.

2,417
APH-0514-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1514-G-R

APH-1514-G-R

APH-1514-G-R

Samtec Inc.

2,826
APH-1514-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1714-G-R

APH-1714-G-R

APH-1714-G-R

Samtec Inc.

1,879
APH-1714-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0814-G-R

APH-0814-G-R

APH-0814-G-R

Samtec Inc.

3,916
APH-0814-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1614-G-R

APH-1614-G-R

APH-1614-G-R

Samtec Inc.

4,945
APH-1614-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0714-G-R

APH-0714-G-R

APH-0714-G-R

Samtec Inc.

3,979
APH-0714-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
111-47-952-41-001000

111-47-952-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

4,060
111-47-952-41-001000

Datasheet

111 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
126-93-318-41-003000

126-93-318-41-003000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

3,365
126-93-318-41-003000

Datasheet

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
126-43-318-41-003000

126-43-318-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,642
126-43-318-41-003000

Datasheet

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
36-3513-11H

36-3513-11H

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

3,117
36-3513-11H

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 105°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
28-7440-10

28-7440-10

CONN SOCKET SIP 28POS TIN

Aries Electronics

3,660
28-7440-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 28 (1 x 28) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Elevated Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
28-7770-10

28-7770-10

CONN SOCKET SIP 28POS TIN

Aries Electronics

3,949
28-7770-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 28 (1 x 28) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Elevated Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
28-7850-10

28-7850-10

CONN SOCKET SIP 28POS TIN

Aries Electronics

3,767
28-7850-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 28 (1 x 28) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Elevated Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
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