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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
126-41-324-41-003000

126-41-324-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,082
126-41-324-41-003000

Datasheet

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
126-41-424-41-003000

126-41-424-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,586
126-41-424-41-003000

Datasheet

126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
126-41-624-41-003000

126-41-624-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,686
126-41-624-41-003000

Datasheet

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
126-91-324-41-003000

126-91-324-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,672
126-91-324-41-003000

Datasheet

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
126-91-424-41-003000

126-91-424-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,301
126-91-424-41-003000

Datasheet

126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
126-91-624-41-003000

126-91-624-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,491
126-91-624-41-003000

Datasheet

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
28-6621-30

28-6621-30

CONN IC DIP SOCKET 28POS TIN

Aries Electronics

4,554
28-6621-30

Datasheet

6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
550-80-145-15-001101

550-80-145-15-001101

PGA SOLDER TAIL

Preci-Dip

2,296
550-80-145-15-001101

Datasheet

550 Bulk Active PGA 145 (15 x 15) Tin - Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
22-0508-21

22-0508-21

CONN SOCKET SIP 22POS GOLD

Aries Electronics

4,819
22-0508-21

Datasheet

508 Bulk Active SIP 22 (1 x 22) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Wire Wrap - Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6 Brass
22-0508-31

22-0508-31

CONN SOCKET SIP 22POS GOLD

Aries Electronics

4,209
22-0508-31

Datasheet

508 Bulk Active SIP 22 (1 x 22) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Wire Wrap - Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6 Brass
22-1508-21

22-1508-21

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

1,588
22-1508-21

Datasheet

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6 Brass
22-1508-31

22-1508-31

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

2,314
22-1508-31

Datasheet

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6 Brass
116-41-328-41-001000

116-41-328-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,805
116-41-328-41-001000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
116-41-428-41-001000

116-41-428-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,084
116-41-428-41-001000

Datasheet

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
116-41-628-41-001000

116-41-628-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,007
116-41-628-41-001000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
116-91-328-41-001000

116-91-328-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,782
116-91-328-41-001000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
116-91-428-41-001000

116-91-428-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,888
116-91-428-41-001000

Datasheet

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
116-91-628-41-001000

116-91-628-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,098
116-91-628-41-001000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
121-13-322-41-001000

121-13-322-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

1,824
121-13-322-41-001000

Datasheet

121 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
121-13-422-41-001000

121-13-422-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

1,829
121-13-422-41-001000

Datasheet

121 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
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