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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
614-43-428-41-001000

614-43-428-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

1,353
614-43-428-41-001000

Datasheet

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
614-43-628-41-001000

614-43-628-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,444
614-43-628-41-001000

Datasheet

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
40-9503-20

40-9503-20

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

4,158
40-9503-20

Datasheet

503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
40-9503-30

40-9503-30

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

1,461
40-9503-30

Datasheet

503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
18-3508-212

18-3508-212

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

1,833
18-3508-212

Datasheet

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
614-93-432-31-012000

614-93-432-31-012000

SOCKET CARRIER LOWPRO .400 32POS

Mill-Max Manufacturing Corp.

3,779
614-93-432-31-012000

Datasheet

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
614-43-432-31-012000

614-43-432-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,398
614-43-432-31-012000

Datasheet

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
40-9513-11H

40-9513-11H

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

1,652
40-9513-11H

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 105°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
117-41-656-41-005000

117-41-656-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,067
117-41-656-41-005000

Datasheet

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 56 (2 x 28) Gold 10.0µin (0.25µm) Beryllium Copper 0.070" (1.78mm) Through Hole Open Frame Solder 0.070" (1.78mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
117-91-656-41-005000

117-91-656-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,381
117-91-656-41-005000

Datasheet

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 56 (2 x 28) Gold 10.0µin (0.25µm) Beryllium Copper 0.070" (1.78mm) Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
116-47-648-41-007000

116-47-648-41-007000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

2,703
116-47-648-41-007000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
121-11-328-41-001000

121-11-328-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,372
121-11-328-41-001000

Datasheet

121 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) - - Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
121-11-428-41-001000

121-11-428-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,750
121-11-428-41-001000

Datasheet

121 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) - - Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
121-11-628-41-001000

121-11-628-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,636
121-11-628-41-001000

Datasheet

121 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) - - Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
31-7400-10

31-7400-10

CONN SOCKET SIP 31POS TIN

Aries Electronics

1,932
31-7400-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 31 (1 x 31) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Elevated Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
31-7440-10

31-7440-10

CONN SOCKET SIP 31POS TIN

Aries Electronics

1,753
31-7440-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 31 (1 x 31) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Elevated Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
31-7500-10

31-7500-10

CONN SOCKET SIP 31POS TIN

Aries Electronics

1,967
31-7500-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 31 (1 x 31) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Elevated Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
16-3508-212

16-3508-212

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3,578
16-3508-212

Datasheet

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
16-3508-312

16-3508-312

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,987
16-3508-312

Datasheet

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
114-41-950-41-117000

114-41-950-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,204
114-41-950-41-117000

Datasheet

114 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
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