Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































Apply All
Reset All
Result
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
27-0508-31

27-0508-31

CONN SOCKET SIP 27POS GOLD

Aries Electronics

1,691
27-0508-31

Datasheet

508 Bulk Active SIP 27 (1 x 27) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Wire Wrap - Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6 Brass
APH-1838-T-H

APH-1838-T-H

APH-1838-T-H

Samtec Inc.

3,191
APH-1838-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0938-T-H

APH-0938-T-H

APH-0938-T-H

Samtec Inc.

1,881
APH-0938-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1038-T-H

APH-1038-T-H

APH-1038-T-H

Samtec Inc.

2,833
APH-1038-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0538-T-H

APH-0538-T-H

APH-0538-T-H

Samtec Inc.

3,521
APH-0538-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1938-T-H

APH-1938-T-H

APH-1938-T-H

Samtec Inc.

4,110
APH-1938-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1538-T-H

APH-1538-T-H

APH-1538-T-H

Samtec Inc.

4,984
APH-1538-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0238-T-H

APH-0238-T-H

APH-0238-T-H

Samtec Inc.

3,593
APH-0238-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1238-T-H

APH-1238-T-H

APH-1238-T-H

Samtec Inc.

2,011
APH-1238-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0338-T-H

APH-0338-T-H

APH-0338-T-H

Samtec Inc.

2,278
APH-0338-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0738-T-H

APH-0738-T-H

APH-0738-T-H

Samtec Inc.

4,358
APH-0738-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1138-T-H

APH-1138-T-H

APH-1138-T-H

Samtec Inc.

1,956
APH-1138-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
116-41-432-41-001000

116-41-432-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,707
116-41-432-41-001000

Datasheet

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
116-41-632-41-001000

116-41-632-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,666
116-41-632-41-001000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
116-91-432-41-001000

116-91-432-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,210
116-91-432-41-001000

Datasheet

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
116-91-632-41-001000

116-91-632-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,051
116-91-632-41-001000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
116-41-640-41-008000

116-41-640-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,629
116-41-640-41-008000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
116-91-640-41-008000

116-91-640-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,990
116-91-640-41-008000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
114-41-952-41-117000

114-41-952-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,064
114-41-952-41-117000

Datasheet

114 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
114-91-952-41-117000

114-91-952-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,349
114-91-952-41-117000

Datasheet

114 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
Total 19086 Record«Prev1... 680681682683684685686687...955Next»
Search Product

Search

Product Category

Products

Tel Us

Phone

My Acccout

User

OEM STOCK
OEM STOCK
[email protected]