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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
146-93-640-41-013000

146-93-640-41-013000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

3,085
146-93-640-41-013000

Datasheet

146 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
146-43-640-41-013000

146-43-640-41-013000

CONN SKT DBL

Mill-Max Manufacturing Corp.

3,574
146-43-640-41-013000

Datasheet

146 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
605-41-640-11-480000

605-41-640-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

3,614
605-41-640-11-480000

Datasheet

605 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
605-91-640-11-480000

605-91-640-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

2,351
605-91-640-11-480000

Datasheet

605 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
110-13-322-41-801000

110-13-322-41-801000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

3,914
110-13-322-41-801000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
36-3571-10

36-3571-10

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

3,515
36-3571-10

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
36-3572-10

36-3572-10

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

4,835
36-3572-10

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
36-3574-10

36-3574-10

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

4,631
36-3574-10

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
36-3575-10

36-3575-10

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

3,648
36-3575-10

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
36-6571-10

36-6571-10

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

3,348
36-6571-10

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
36-6572-10

36-6572-10

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

4,799
36-6572-10

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
36-6573-10

36-6573-10

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

4,951
36-6573-10

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
36-6574-10

36-6574-10

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

1,356
36-6574-10

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
36-6575-10

36-6575-10

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

2,929
36-6575-10

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
123-91-636-41-001000

123-91-636-41-001000

SOCKET IC OPEN 3 LVL .600 36POS

Mill-Max Manufacturing Corp.

1,579
123-91-636-41-001000

Datasheet

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
123-41-636-41-001000

123-41-636-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,105
123-41-636-41-001000

Datasheet

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
APA-632-G-M

APA-632-G-M

ADAPTER PLUG

Samtec Inc.

4,791
APA-632-G-M

Datasheet

APA Tube Active - 32 (2 x 16) Gold 20.0µin (0.51µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold - 20.0µin (0.51µm) Polybutylene Terephthalate (PBT), Glass Filled Phosphor Bronze
612-13-322-41-001000

612-13-322-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

4,642
612-13-322-41-001000

Datasheet

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
612-13-422-41-001000

612-13-422-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

3,836
612-13-422-41-001000

Datasheet

612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
44-6551-10

44-6551-10

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

4,254
44-6551-10

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
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