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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
122-13-624-41-001000

122-13-624-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

4,798
122-13-624-41-001000

Datasheet

122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
APH-0928-T-R

APH-0928-T-R

APH-0928-T-R

Samtec Inc.

1,541
APH-0928-T-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0728-T-R

APH-0728-T-R

APH-0728-T-R

Samtec Inc.

4,311
APH-0728-T-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1228-T-R

APH-1228-T-R

APH-1228-T-R

Samtec Inc.

3,934
APH-1228-T-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0228-T-R

APH-0228-T-R

APH-0228-T-R

Samtec Inc.

1,734
APH-0228-T-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1628-T-R

APH-1628-T-R

APH-1628-T-R

Samtec Inc.

3,872
APH-1628-T-R

Datasheet

* - Active - - - - - - - - - - - - - - -
44-6556-30

44-6556-30

CONN IC DIP SOCKET 44POS GOLD

Aries Electronics

1,157
44-6556-30

Datasheet

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 44 (2 x 22) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Brass
44-6556-20

44-6556-20

CONN IC DIP SOCKET 44POS GOLD

Aries Electronics

1,170
44-6556-20

Datasheet

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 44 (2 x 22) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Brass
24-3551-11

24-3551-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

1,380
24-3551-11

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold - Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - - Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
24-3552-11

24-3552-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

2,389
24-3552-11

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold - Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - - Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
24-3553-11

24-3553-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

2,808
24-3553-11

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold - Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - - Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
24-6551-11

24-6551-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

1,873
24-6551-11

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold - Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - - Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
24-6552-11

24-6552-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

3,939
24-6552-11

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold - Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - - Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
24-3554-11

24-3554-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

1,077
24-3554-11

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold - Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - - Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
210790-4

210790-4

CONN SOCKET PGA 128POS GOLD

TE Connectivity AMP Connectors

4,570
210790-4

Datasheet

STA Bulk Obsolete PGA 128 (13 x 13) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead - 118.1µin (3.00µm) Thermoplastic, Polyester, Glass Filled Phosphor Bronze
24-3503-31

24-3503-31

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,620
24-3503-31

Datasheet

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
40-6572-10

40-6572-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

2,390
40-6572-10

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
APA-648-T-C

APA-648-T-C

ADAPTER PLUG

Samtec Inc.

3,090
APA-648-T-C

Datasheet

APA Bulk Active - 48 (2 x 24) Tin - Phosphor Bronze 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - - Polybutylene Terephthalate (PBT), Glass Filled Phosphor Bronze
126-93-432-41-001000

126-93-432-41-001000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

3,280
126-93-432-41-001000

Datasheet

126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
126-93-632-41-001000

126-93-632-41-001000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

2,131
126-93-632-41-001000

Datasheet

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
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