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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
116-43-650-41-006000

116-43-650-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,014
116-43-650-41-006000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
APH-0530-T-H

APH-0530-T-H

APH-0530-T-H

Samtec Inc.

3,078
APH-0530-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1530-T-H

APH-1530-T-H

APH-1530-T-H

Samtec Inc.

2,348
APH-1530-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1130-T-H

APH-1130-T-H

APH-1130-T-H

Samtec Inc.

1,505
APH-1130-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1730-T-H

APH-1730-T-H

APH-1730-T-H

Samtec Inc.

3,484
APH-1730-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1630-T-H

APH-1630-T-H

APH-1630-T-H

Samtec Inc.

3,904
APH-1630-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1330-T-H

APH-1330-T-H

APH-1330-T-H

Samtec Inc.

4,067
APH-1330-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1230-T-H

APH-1230-T-H

APH-1230-T-H

Samtec Inc.

3,626
APH-1230-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
714-43-234-31-018000

714-43-234-31-018000

CONN IC DIP SOCKET 34POS GOLD

Mill-Max Manufacturing Corp.

4,931
714-43-234-31-018000

Datasheet

714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 34 (2 x 17) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 30.0µin (0.76µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
614-93-636-31-018000

614-93-636-31-018000

CONN IC DIP SOCKET 36POS GOLD

Mill-Max Manufacturing Corp.

4,774
614-93-636-31-018000

Datasheet

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
614-43-636-31-018000

614-43-636-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,080
614-43-636-31-018000

Datasheet

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 30.0µin (0.76µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
28-C182-20

28-C182-20

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

1,076
28-C182-20

Datasheet

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
28-C182-30

28-C182-30

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

4,142
28-C182-30

Datasheet

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
28-C212-20

28-C212-20

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

4,483
28-C212-20

Datasheet

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
28-C212-30

28-C212-30

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

4,988
28-C212-30

Datasheet

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
28-C300-20

28-C300-20

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2,493
28-C300-20

Datasheet

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
28-C300-30

28-C300-30

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

4,502
28-C300-30

Datasheet

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
612-41-432-41-004000

612-41-432-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2,031
612-41-432-41-004000

Datasheet

612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
612-41-632-41-004000

612-41-632-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,651
612-41-632-41-004000

Datasheet

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
612-91-432-41-004000

612-91-432-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,162
612-91-432-41-004000

Datasheet

612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
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