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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
614-41-648-41-001000

614-41-648-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,149
614-41-648-41-001000

Datasheet

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
614-91-648-41-001000

614-91-648-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

1,831
614-91-648-41-001000

Datasheet

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
612-41-636-41-004000

612-41-636-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,709
612-41-636-41-004000

Datasheet

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
612-91-636-41-004000

612-91-636-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

4,054
612-91-636-41-004000

Datasheet

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
605-41-652-11-480000

605-41-652-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

4,144
605-41-652-11-480000

Datasheet

605 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
605-91-652-11-480000

605-91-652-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

3,558
605-91-652-11-480000

Datasheet

605 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
APH-1834-T-H

APH-1834-T-H

APH-1834-T-H

Samtec Inc.

4,357
APH-1834-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0534-T-H

APH-0534-T-H

APH-0534-T-H

Samtec Inc.

2,112
APH-0534-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1934-T-H

APH-1934-T-H

APH-1934-T-H

Samtec Inc.

4,491
APH-1934-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1534-T-H

APH-1534-T-H

APH-1534-T-H

Samtec Inc.

3,119
APH-1534-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0434-T-H

APH-0434-T-H

APH-0434-T-H

Samtec Inc.

1,123
APH-0434-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1234-T-H

APH-1234-T-H

APH-1234-T-H

Samtec Inc.

3,259
APH-1234-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
116-93-310-61-003000

116-93-310-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,927
116-93-310-61-003000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
121-11-640-41-001000

121-11-640-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,859
121-11-640-41-001000

Datasheet

121 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) - - Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
40-0501-21

40-0501-21

CONN SOCKET SIP 40POS GOLD

Aries Electronics

3,515
40-0501-21

Datasheet

501 Bulk Active SIP 40 (1 x 40) Gold 10.0µin (0.25µm) Phosphor Bronze 0.100" (2.54mm) Through Hole - Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
40-0501-31

40-0501-31

CONN SOCKET SIP 40POS GOLD

Aries Electronics

1,997
40-0501-31

Datasheet

501 Bulk Active SIP 40 (1 x 40) Gold 10.0µin (0.25µm) Phosphor Bronze 0.100" (2.54mm) Through Hole - Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
123-43-328-41-801000

123-43-328-41-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,439
123-43-328-41-801000

Datasheet

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
123-93-328-41-801000

123-93-328-41-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,207
123-93-328-41-801000

Datasheet

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
44-6571-10

44-6571-10

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

1,717
44-6571-10

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
612-11-432-41-001000

612-11-432-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,967
612-11-432-41-001000

Datasheet

612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) - - Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) - -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
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