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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
24-C212-31

24-C212-31

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

1,327
24-C212-31

Datasheet

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
24-C300-21

24-C300-21

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

1,704
24-C300-21

Datasheet

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
116-93-652-41-007000

116-93-652-41-007000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

3,538
116-93-652-41-007000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
116-43-652-41-007000

116-43-652-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,580
116-43-652-41-007000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
116-43-210-61-008000

116-43-210-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,285
116-43-210-61-008000

Datasheet

116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
116-93-210-61-008000

116-93-210-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,687
116-93-210-61-008000

Datasheet

116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
116-41-648-41-001000

116-41-648-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,581
116-41-648-41-001000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
116-91-648-41-001000

116-91-648-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,842
116-91-648-41-001000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
614-41-952-31-018000

614-41-952-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,470
614-41-952-31-018000

Datasheet

614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
614-91-952-31-018000

614-91-952-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

1,822
614-91-952-31-018000

Datasheet

614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
111-93-314-61-001000

111-93-314-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,700
111-93-314-61-001000

Datasheet

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
612-41-642-41-004000

612-41-642-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2,036
612-41-642-41-004000

Datasheet

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
612-91-642-41-004000

612-91-642-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

4,081
612-91-642-41-004000

Datasheet

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
APH-0914-G-R

APH-0914-G-R

APH-0914-G-R

Samtec Inc.

1,298
APH-0914-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1414-G-R

APH-1414-G-R

APH-1414-G-R

Samtec Inc.

1,246
APH-1414-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1914-G-R

APH-1914-G-R

APH-1914-G-R

Samtec Inc.

1,336
APH-1914-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1014-G-R

APH-1014-G-R

APH-1014-G-R

Samtec Inc.

1,942
APH-1014-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0614-G-R

APH-0614-G-R

APH-0614-G-R

Samtec Inc.

4,701
APH-0614-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1114-G-R

APH-1114-G-R

APH-1114-G-R

Samtec Inc.

4,682
APH-1114-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0214-G-R

APH-0214-G-R

APH-0214-G-R

Samtec Inc.

4,307
APH-0214-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
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