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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
612-91-648-41-003000

612-91-648-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,974
612-91-648-41-003000

Datasheet

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
104-13-648-41-770000

104-13-648-41-770000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.

1,747
104-13-648-41-770000

Datasheet

104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Thermoplastic Brass Alloy
122-11-636-41-001000

122-11-636-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,813
122-11-636-41-001000

Datasheet

122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) - - Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
517-87-429-19-101111

517-87-429-19-101111

CONN SOCKET PGA 429POS GOLD

Preci-Dip

4,826
517-87-429-19-101111

Datasheet

517 Bulk Active PGA 429 (19 x 19) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
124-41-642-41-002000

124-41-642-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,692
124-41-642-41-002000

Datasheet

124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
124-91-642-41-002000

124-91-642-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,980
124-91-642-41-002000

Datasheet

124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
110-43-320-61-605000

110-43-320-61-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,825
110-43-320-61-605000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
20-4508-21

20-4508-21

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

4,185
20-4508-21

Datasheet

508 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
20-4508-31

20-4508-31

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,452
20-4508-31

Datasheet

508 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
APO-324-G-R

APO-324-G-R

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

3,703
APO-324-G-R

Datasheet

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polybutylene Terephthalate (PBT), Glass Filled Phosphor Bronze
APO-624-G-R

APO-624-G-R

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

3,160
APO-624-G-R

Datasheet

APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polybutylene Terephthalate (PBT), Glass Filled Phosphor Bronze
614-93-650-31-018000

614-93-650-31-018000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

3,693
614-93-650-31-018000

Datasheet

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
614-43-650-31-018000

614-43-650-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,986
614-43-650-31-018000

Datasheet

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 30.0µin (0.76µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
110-43-322-61-001000

110-43-322-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,852
110-43-322-61-001000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
APH-0936-T-H

APH-0936-T-H

APH-0936-T-H

Samtec Inc.

2,301
APH-0936-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0536-T-H

APH-0536-T-H

APH-0536-T-H

Samtec Inc.

2,949
APH-0536-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1936-T-H

APH-1936-T-H

APH-1936-T-H

Samtec Inc.

2,845
APH-1936-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1736-T-H

APH-1736-T-H

APH-1736-T-H

Samtec Inc.

4,378
APH-1736-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1636-T-H

APH-1636-T-H

APH-1636-T-H

Samtec Inc.

4,354
APH-1636-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0836-T-H

APH-0836-T-H

APH-0836-T-H

Samtec Inc.

3,639
APH-0836-T-H

Datasheet

* - Active - - - - - - - - - - - - - - -
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