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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
    614-93-964-31-002000

    614-93-964-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 1,023
    RFQ Sell Excess Inventory
    		614-93-964-31-002000

    Datasheet

         		614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
    64-9503-20

    64-9503-20

    CONN IC DIP SOCKET 64POS GOLD

    Aries Electronics

    		 3,469
    RFQ Sell Excess Inventory
    		64-9503-20

    Datasheet

         		503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
    116-43-314-61-007000

    116-43-314-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 1,277
    RFQ Sell Excess Inventory
    		116-43-314-61-007000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
    116-93-314-61-007000

    116-93-314-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,978
    RFQ Sell Excess Inventory
    		116-93-314-61-007000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
    110-93-318-61-105000

    110-93-318-61-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,057
    RFQ Sell Excess Inventory
    		110-93-318-61-105000

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
    614-93-964-31-007000

    614-93-964-31-007000

    SOCKET CARRIER LOWPRO .900 64POS

    Mill-Max Manufacturing Corp.

    		 4,354
    RFQ Sell Excess Inventory
    		614-93-964-31-007000

    Datasheet

         		614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
    614-43-964-31-007000

    614-43-964-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 2,599
    RFQ Sell Excess Inventory
    		614-43-964-31-007000

    Datasheet

         		614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
    40-3552-11

    40-3552-11

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    		 2,932
    RFQ Sell Excess Inventory
    		40-3552-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) Gold - Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - - Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    40-3553-11

    40-3553-11

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    		 1,864
    RFQ Sell Excess Inventory
    		40-3553-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) Gold - Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - - Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    40-6551-11

    40-6551-11

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    		 3,527
    RFQ Sell Excess Inventory
    		40-6551-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold - Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - - Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    40-6552-11

    40-6552-11

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    		 3,041
    RFQ Sell Excess Inventory
    		40-6552-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold - Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - - Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    40-6553-11

    40-6553-11

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    		 3,624
    RFQ Sell Excess Inventory
    		40-6553-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) Nickel Boron 50.0µin (1.27µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron - 50.0µin (1.27µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    115-43-650-61-001000

    115-43-650-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,997
    RFQ Sell Excess Inventory
    		115-43-650-61-001000

    Datasheet

         		115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
    612-43-650-41-004000

    612-43-650-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 4,113
    RFQ Sell Excess Inventory
    		612-43-650-41-004000

    Datasheet

         		612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
    612-93-650-41-004000

    612-93-650-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 3,575
    RFQ Sell Excess Inventory
    		612-93-650-41-004000

    Datasheet

         		612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
    24-6574-11

    24-6574-11

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    		 4,535
    RFQ Sell Excess Inventory
    		24-6574-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    24-3571-11

    24-3571-11

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    		 2,954
    RFQ Sell Excess Inventory
    		24-3571-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    24-3572-11

    24-3572-11

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    		 4,163
    RFQ Sell Excess Inventory
    		24-3572-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    24-3573-11

    24-3573-11

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    		 2,954
    RFQ Sell Excess Inventory
    		24-3573-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    24-3574-11

    24-3574-11

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    		 1,283
    RFQ Sell Excess Inventory
    		24-3574-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
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