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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
116-43-624-61-008000

116-43-624-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,011
116-43-624-61-008000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
44-3551-11

44-3551-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

2,245
44-3551-11

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) Gold - Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - - Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
44-3552-11

44-3552-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

2,192
44-3552-11

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) Gold - Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - - Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
44-3553-11

44-3553-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

3,227
44-3553-11

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) Gold - Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - - Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
44-6551-11

44-6551-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

4,557
44-6551-11

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) Gold - Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - - Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
44-3554-11

44-3554-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

4,108
44-3554-11

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) Gold - Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - - Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
44-6554-11

44-6554-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

1,867
44-6554-11

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) Gold - Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - - Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
32-6508-212

32-6508-212

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

4,011
32-6508-212

Datasheet

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
32-6508-312

32-6508-312

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

1,457
32-6508-312

Datasheet

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
116-43-640-61-008000

116-43-640-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,252
116-43-640-61-008000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
510-93-133-14-071001

510-93-133-14-071001

CONN SOCKET PGA 133POS GOLD

Mill-Max Manufacturing Corp.

1,888
510-93-133-14-071001

Datasheet

510 Tube Active PGA 133 (14 x 14) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) - -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
117-93-430-61-005000

117-93-430-61-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,687
117-93-430-61-005000

Datasheet

117 Tube Active DIP, 0.4" (10.16mm) Row Spacing 30 (2 x 15) Gold 30.0µin (0.76µm) Beryllium Copper 0.070" (1.78mm) Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
APO-422-G-H

APO-422-G-H

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

1,772
APO-422-G-H

Datasheet

* - Active - - - - - - - - - - - - - - -
38-3503-21

38-3503-21

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

2,797
38-3503-21

Datasheet

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 38 (2 x 19) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
38-3503-31

38-3503-31

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

3,670
38-3503-31

Datasheet

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 38 (2 x 19) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
HLS-0220-G-18

HLS-0220-G-18

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

4,960
HLS-0220-G-18

Datasheet

HLS Tube Active SIP 40 (2 x 20) Gold 30.0µin (0.76µm) - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 140°C 10.0µin (0.25µm) Thermoplastic -
122-13-640-41-801000

122-13-640-41-801000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

4,789
122-13-640-41-801000

Datasheet

122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
550-80-225-18-091101

550-80-225-18-091101

PGA SOLDER TAIL

Preci-Dip

4,068
550-80-225-18-091101

Datasheet

550 Bulk Active PGA 225 (18 x 18) Tin - Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
HLS-0420-T-2

HLS-0420-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

4,971
HLS-0420-T-2

Datasheet

HLS Bulk Active SIP 80 (4 x 20) Tin - - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) - -55°C ~ 140°C - Thermoplastic -
40-0511-11

40-0511-11

CONN SOCKET SIP 40POS GOLD

Aries Electronics

3,654
40-0511-11

Datasheet

511 Bulk Active SIP 40 (1 x 40) Gold 10.0µin (0.25µm) Phosphor Bronze 0.100" (2.54mm) Through Hole - Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
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