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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
APH-1520-G-R

APH-1520-G-R

APH-1520-G-R

Samtec Inc.

2,753
APH-1520-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1120-G-R

APH-1120-G-R

APH-1120-G-R

Samtec Inc.

2,689
APH-1120-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0420-G-R

APH-0420-G-R

APH-0420-G-R

Samtec Inc.

4,188
APH-0420-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1320-G-R

APH-1320-G-R

APH-1320-G-R

Samtec Inc.

3,875
APH-1320-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
110-93-624-61-801000

110-93-624-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,809
110-93-624-61-801000

Datasheet

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
510-13-044-08-031003

510-13-044-08-031003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

4,421
510-13-044-08-031003

Datasheet

510 Bulk Active PGA 44 (8 x 8) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
48-3551-11

48-3551-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

3,677
48-3551-11

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) Gold - Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - - Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
48-3552-11

48-3552-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

4,124
48-3552-11

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) Gold - Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - - Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
48-6551-11

48-6551-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

4,591
48-6551-11

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold - Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - - Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
48-6552-11

48-6552-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

1,582
48-6552-11

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold - Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - - Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
48-6553-11

48-6553-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

1,139
48-6553-11

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold - Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - - Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
48-3554-11

48-3554-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

3,949
48-3554-11

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) Gold - Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - - Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
116-43-642-61-001000

116-43-642-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,327
116-43-642-61-001000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
127-43-764-41-003000

127-43-764-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,790
127-43-764-41-003000

Datasheet

127 Tube Active DIP, 0.75" (19.05mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper 0.070" (1.78mm) Through Hole Open Frame Wire Wrap 0.070" (1.78mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
614-83-179-18-111112

614-83-179-18-111112

CONN SOCKET PGA 179POS GOLD

Preci-Dip

3,971
614-83-179-18-111112

Datasheet

614 Bulk Active PGA 179 (18 x 18) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
614-83-179-18-112112

614-83-179-18-112112

CONN SOCKET PGA 179POS GOLD

Preci-Dip

3,483
614-83-179-18-112112

Datasheet

614 Bulk Active PGA 179 (18 x 18) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
614-87-225-17-061112

614-87-225-17-061112

CONN SOCKET PGA 225POS GOLD

Preci-Dip

4,504
614-87-225-17-061112

Datasheet

614 Bulk Active PGA 225 (17 x 17) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
110-43-952-61-001000

110-43-952-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,070
110-43-952-61-001000

Datasheet

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
200-6325-NUN-8100

200-6325-NUN-8100

CAMLEVER-STANDARD

3M

4,838
200-6325-NUN-8100

Datasheet

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 625 (25 x 25) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Solder 0.100" (2.54mm) Gold -55°C ~ 150°C 30.0µin (0.76µm) Polyethersulfone (PES) Beryllium Copper
36-6556-31

36-6556-31

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

1,979
36-6556-31

Datasheet

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyphenylene Sulfide (PPS), Glass Filled Brass
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