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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
APH-1438-G-H

APH-1438-G-H

APH-1438-G-H

Samtec Inc.

1,009
APH-1438-G-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0538-G-H

APH-0538-G-H

APH-0538-G-H

Samtec Inc.

1,229
APH-0538-G-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1938-G-H

APH-1938-G-H

APH-1938-G-H

Samtec Inc.

2,119
APH-1938-G-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1538-G-H

APH-1538-G-H

APH-1538-G-H

Samtec Inc.

1,909
APH-1538-G-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0838-G-H

APH-0838-G-H

APH-0838-G-H

Samtec Inc.

2,190
APH-0838-G-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1638-G-H

APH-1638-G-H

APH-1638-G-H

Samtec Inc.

4,222
APH-1638-G-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1238-G-H

APH-1238-G-H

APH-1238-G-H

Samtec Inc.

1,543
APH-1238-G-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0738-G-H

APH-0738-G-H

APH-0738-G-H

Samtec Inc.

2,046
APH-0738-G-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0238-G-H

APH-0238-G-H

APH-0238-G-H

Samtec Inc.

4,603
APH-0238-G-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0338-G-H

APH-0338-G-H

APH-0338-G-H

Samtec Inc.

3,876
APH-0338-G-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0638-G-H

APH-0638-G-H

APH-0638-G-H

Samtec Inc.

4,572
APH-0638-G-H

Datasheet

* - Active - - - - - - - - - - - - - - -
42-6570-11

42-6570-11

CONN IC DIP SOCKET ZIF 42POS GLD

Aries Electronics

2,232
42-6570-11

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
42-6573-11

42-6573-11

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

4,444
42-6573-11

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
514-83-256M16-000148

514-83-256M16-000148

CONN SOCKET BGA 256POS GOLD

Preci-Dip

2,524
514-83-256M16-000148

Datasheet

514 Bulk Active BGA 256 (16 x 16) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
514-83-256M20-001148

514-83-256M20-001148

CONN SOCKET BGA 256POS GOLD

Preci-Dip

2,287
514-83-256M20-001148

Datasheet

514 Bulk Active BGA 256 (20 x 20) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
614-87-299-20-001112

614-87-299-20-001112

CONN SOCKET PGA 299POS GOLD

Preci-Dip

2,867
614-87-299-20-001112

Datasheet

614 Bulk Active PGA 299 (20 x 20) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
510-91-209-17-081003

510-91-209-17-081003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,473
510-91-209-17-081003

Datasheet

510 Bulk Active PGA 209 (17 x 17) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
120-PGM13015-40

120-PGM13015-40

CONN SOCKET PGA GOLD

Aries Electronics

2,764
120-PGM13015-40

Datasheet

PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
614-83-238-19-101112

614-83-238-19-101112

CONN SOCKET PGA 238POS GOLD

Preci-Dip

1,402
614-83-238-19-101112

Datasheet

614 Bulk Active PGA 238 (19 x 19) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
133-PGM14014-40

133-PGM14014-40

CONN SOCKET PGA GOLD

Aries Electronics

1,720
133-PGM14014-40

Datasheet

PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
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