| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
144-PGM13095-11CONN SOCKET PGA GOLD |
1,505 |
|
Datasheet |
PGM | Bulk | Active | PGA | - | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
28-3552-16CONN IC DIP SOCKET ZIF 28POS |
2,449 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | - | 50.0µin (1.27µm) | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Copper |
|
|
APH-0532-G-RAPH-0532-G-R |
2,731 |
|
Datasheet |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-0932-G-RAPH-0932-G-R |
1,309 |
|
Datasheet |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-0632-G-RAPH-0632-G-R |
1,352 |
|
Datasheet |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-0332-G-RAPH-0332-G-R |
1,832 |
|
Datasheet |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1732-G-RAPH-1732-G-R |
4,107 |
|
Datasheet |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-0832-G-RAPH-0832-G-R |
2,040 |
|
Datasheet |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
232-1270-01-0602CONN SOCKET PGA ZIF 32POS GOLD |
4,877 |
|
Datasheet |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 32 (2 x 16) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polysulfone (PSU), Glass Filled | Beryllium Copper |
|
|
232-1270-02-0602CONN SOCKET PGA ZIF 32POS GOLD |
1,266 |
|
Datasheet |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 32 (2 x 16) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polysulfone (PSU), Glass Filled | Beryllium Copper |
|
|
517-83-529-21-121111CONN SOCKET PGA 529POS GOLD |
2,699 |
|
Datasheet |
517 | Bulk | Active | PGA | 529 (21 x 21) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
232-1270-51-0602STAGGERED ZIP STRIP POCKETS 32 C |
4,696 |
|
Datasheet |
Textool™ | - | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
546-87-403-19-111147CONN SOCKET PGA 403POS GOLD |
2,387 |
|
Datasheet |
546 | Bulk | Active | PGA | 403 (19 x 19) | Gold | Flash | Beryllium Copper | 0.050" (1.27mm) | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Bronze |
|
|
510-93-223-18-095002SKT PGA SOLDRTL |
4,846 |
|
Datasheet |
510 | Tube | Active | PGA | 223 (18 x 18) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
510-13-121-11-000002SKT PGA SOLDRTL |
4,068 |
|
Datasheet |
510 | Bulk | Active | PGA | 121 (11 x 11) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
510-13-121-11-000003SKT PGA SOLDRTL |
4,804 |
|
Datasheet |
510 | Bulk | Active | PGA | 121 (11 x 11) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
24-3572-16CONN IC DIP SOCKET ZIF 24POS |
2,817 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | - | 50.0µin (1.27µm) | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Nickel |
|
|
116-43-964-61-001000CONN IC SKT DBL |
2,673 |
|
Datasheet |
116 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
116-93-964-61-001000CONN IC SKT DBL |
3,915 |
|
Datasheet |
116 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
28-6556-41CONN IC DIP SOCKET 28POS GOLD |
2,555 |
|
Datasheet |
6556 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder Cup | 0.100" (2.54mm) | Gold | - | 10.0µin (0.25µm) | Polyphenylene Sulfide (PPS), Glass Filled | Brass |
Upload
