| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
WMS-280ZCONN IC DIP SOCKET 28POS GOLD |
4,320 |
|
Datasheet |
WMS | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame, Wash Away | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | - | Brass |
|
AR06-HZW/T-RCONN IC DIP SOCKET 6POS TIN |
3,356 |
|
Datasheet |
- | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Thermoplastic, Polyester, Glass Filled | Beryllium Copper |
|
|
AR 20 HGL-TTSOCKET |
2,820 |
|
Datasheet |
AR | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -40°C ~ 105°C | Flash | Polybutylene Terephthalate (PBT), Glass Filled | Brass |
|
|
HLS-0103-TT-12.100" SCREW MACHINE SOCKET ARRAY |
3,031 |
|
Datasheet |
HLS | Tube | Active | SIP | 3 (1 x 3) | Tin | - | - | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 140°C | - | Thermoplastic | - |
|
110-83-210-41-001101CONN IC DIP SOCKET 10POS GOLD |
1,695 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
110-87-310-41-105101CONN IC DIP SOCKET 10POS GOLD |
2,383 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
DIP328-014BDIP328-014B-DIP SOCKET 28 CTS |
1,833 |
|
Datasheet |
- | Bag | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Tin-Lead | 100.0µin (2.54µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
AR28-HZL/7/07-TTCONN IC DIP SOCKET 28POS GOLD |
1,014 |
|
Datasheet |
- | Bag | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Thermoplastic, Polyester | Beryllium Copper |
|
|
01-0503-31CONN SOCKET SIP 1POS GOLD |
2,573 |
|
Datasheet |
0503 | Bulk | Active | SIP | 1 (1 x 1) | Gold | 30.0µin (0.76µm) | Beryllium Copper | - | Through Hole | - | Wire Wrap | - | Gold | - | 30.0µin (0.76µm) | Polyamide (PA), Nylon, Glass Filled | Brass |
|
|
110-87-320-41-001151CONN IC DIP SOCKET 20POS GOLD |
4,823 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame, No Center Bar | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
116-87-306-41-001101CONN IC DIP SOCKET 6POS GOLD |
3,396 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
A-CCS32-Z-SM-RCONN SOCKET PLCC 32POS TIN |
1,512 |
|
Datasheet |
- | Tube | Obsolete | PLCC | 32 (2 x 7, 2 x 9) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | -55°C ~ 105°C | 150.0µin (3.81µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
|
|
A-CCS020-Z-SM/PSOCKET |
4,372 |
|
Datasheet |
- | Bulk | Active | PLCC | 20 | Tin | 160.0µin (4.06µm) | Phosphor Bronze | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Tin | -40°C ~ 105°C | 160.0µin (4.06µm) | Polyphenylene Sulfide (PPS), Glass Filled | Phosphor Bronze |
|
|
AW 127-38/Z-TSOCKET 38 CONTACTS SINGLE ROW |
4,327 |
|
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
410-87-214-10-001101CONN ZIG-ZAG 14POS GOLD |
3,517 |
|
Datasheet |
410 | Bulk | Active | Zig-Zag | 14 (2 x 7) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
410-87-214-10-002101CONN ZIG-ZAG 14POS GOLD |
3,604 |
|
Datasheet |
410 | Bulk | Active | Zig-Zag | 14 (2 x 7) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
124-83-304-41-002101CONN IC DIP SOCKET 4POS GOLD |
2,472 |
|
Datasheet |
124 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
116-87-610-41-006101CONN IC DIP SOCKET 10POS GOLD |
4,549 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 10 (2 x 5) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
1051670001SMIA65 TOP MNT CAMERA SOCKET |
2,327 |
|
Datasheet |
105167 | Tape & Reel (TR) | Obsolete | Camera Socket | 12 (2 x 6) | Gold | 12.0µin (0.30µm) | Copper Alloy | 0.037" (0.95mm) | Surface Mount | Open Frame | Solder | - | Gold | -55°C ~ 85°C | Flash | Thermoplastic | Copper Alloy |
|
122-83-306-41-001101CONN IC DIP SOCKET 6POS GOLD |
4,988 |
|
Datasheet |
122 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
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