Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































Apply All
Reset All
Result
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
DIP324-011B

DIP324-011B

DIP324-011B-DIP SOCKET 24 CTS

Amphenol ICC (FCI)

2,493
DIP324-011B

Datasheet

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
116-83-306-41-003101

116-83-306-41-003101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

4,265
116-83-306-41-003101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
02-0513-11H

02-0513-11H

CONN SOCKET SIP 2POS GOLD

Aries Electronics

4,849
02-0513-11H

Datasheet

0513 Bulk Active SIP 2 (1 x 2) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
04-0513-10

04-0513-10

CONN SOCKET SIP 4POS GOLD

Aries Electronics

2,448
04-0513-10

Datasheet

0513 Bulk Active SIP 4 (1 x 4) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
ED020PLCZ-SM-N

ED020PLCZ-SM-N

CONN SOCKET PLCC 20POS

On Shore Technology Inc.

4,695
ED020PLCZ-SM-N

Datasheet

ED Tube Active PLCC 20 (4 x 5) - - Phosphor Bronze 0.050" (1.27mm) Surface Mount Closed Frame Solder 0.050" (1.27mm) - -55°C ~ 105°C - Polyphenylene Sulfide (PPS) Phosphor Bronze
AR 18 HGL-TT

AR 18 HGL-TT

SOCKET

Assmann WSW Components

3,132
AR 18 HGL-TT

Datasheet

AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold -40°C ~ 105°C Flash Polybutylene Terephthalate (PBT), Glass Filled Brass
110-87-318-41-001151

110-87-318-41-001151

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

4,573
110-87-318-41-001151

Datasheet

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame, No Center Bar Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
PRT-07937

PRT-07937

DIP SOCKETS SOLDER TAIL - 8-PIN

SparkFun Electronics

4,471
PRT-07937

Datasheet

- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) - - - - Through Hole Open Frame Solder - - - - - -
110-87-312-01-680101

110-87-312-01-680101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

3,636
110-87-312-01-680101

Datasheet

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6), 6 Loaded Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
614-87-308-31-012101

614-87-308-31-012101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

3,768
614-87-308-31-012101

Datasheet

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
DIP318-001B

DIP318-001B

DIP318-001B-DIP SOCKET 18 CTS

Amphenol ICC (FCI)

2,933
DIP318-001B

Datasheet

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
110-87-314-41-005101

110-87-314-41-005101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

2,363
110-87-314-41-005101

Datasheet

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
SIP050-1X09-157B

SIP050-1X09-157B

1X09-157B-SIP SOCKET 9 CTS

Amphenol ICC (FCI)

2,015
SIP050-1X09-157B

Datasheet

SIP050-1x Bulk Active SIP 9 (1 x 9) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
110-83-310-41-001101

110-83-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

1,989
110-83-310-41-001101

Datasheet

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
116-87-306-41-009101

116-87-306-41-009101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

2,897
116-87-306-41-009101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
A-CCS044-Z-SM/P

A-CCS044-Z-SM/P

SOCKET

Assmann WSW Components

3,520
A-CCS044-Z-SM/P

Datasheet

- Bulk Active PLCC 44 Tin 160.0µin (4.06µm) Phosphor Bronze 0.050" (1.27mm) Through Hole Closed Frame Solder 0.050" (1.27mm) Tin -40°C ~ 105°C 160.0µin (4.06µm) Polyphenylene Sulfide (PPS), Glass Filled Phosphor Bronze
114-83-308-41-117101

114-83-308-41-117101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

3,909
114-83-308-41-117101

Datasheet

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
822473-3

822473-3

CONN SOCKET PLCC 32POS TIN-LEAD

TE Connectivity AMP Connectors

3,984
822473-3

Datasheet

- Tube Obsolete PLCC 32 (2 x 7, 2 x 9) Tin-Lead - Phosphor Bronze 0.050" (1.27mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead - - Thermoplastic Phosphor Bronze
614-87-610-41-001101

614-87-610-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3,194
614-87-610-41-001101

Datasheet

614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
940-99-084-24-000000

940-99-084-24-000000

CONN SOCKET PLCC 84POS TIN-LEAD

Mill-Max Manufacturing Corp.

3,019
940-99-084-24-000000

Datasheet

940 Tube Obsolete PLCC 84 (4 x 21) Tin-Lead 100.0µin (2.54µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
Total 19086 Record«Prev1... 99100101102103104105106...955Next»
Search Product

Search

Product Category

Products

Tel Us

Phone

My Acccout

User

OEM STOCK
OEM STOCK
[email protected]