| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
01-0508-20CONN SOCKET SIP 1POS GOLD |
1,510 |
|
Datasheet |
508 | Bulk | Active | SIP | 1 (1 x 1) | Gold | 10.0µin (0.25µm) | Beryllium Copper | - | Through Hole | - | Wire Wrap | - | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6 | Brass |
|
|
01-0508-30CONN SOCKET SIP 1POS GOLD |
3,009 |
|
Datasheet |
508 | Bulk | Active | SIP | 1 (1 x 1) | Gold | 10.0µin (0.25µm) | Beryllium Copper | - | Through Hole | - | Wire Wrap | - | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6 | Brass |
|
|
AW 127-30/Z-TSOCKET 30 CONTACTS SINGLE ROW |
1,518 |
|
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
AJ 28-LCSOCKET |
1,564 |
|
Datasheet |
- | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 28 (2 x 14) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | 0.070" (1.78mm) | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Tin | -55°C ~ 85°C | - | Polybutylene Terephthalate (PBT) | Phosphor Bronze |
|
116-87-304-41-011101CONN IC DIP SOCKET 4POS GOLD |
2,264 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
PRT-07939DIP SOCKETS SOLDER TAIL - 14-PIN |
1,628 |
|
Datasheet |
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | - | - | - | - | Through Hole | Open Frame | Solder | - | - | - | - | - | - |
|
|
PRT-07938DIP SOCKETS SOLDER TAIL - 16-PIN |
4,350 |
|
Datasheet |
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | - | - | - | - | Through Hole | Open Frame | Solder | - | - | - | - | - | - |
|
|
HLS-0103-TT-10.100" SCREW MACHINE SOCKET ARRAY |
3,868 |
|
Datasheet |
HLS | Tube | Active | SIP | 3 (1 x 3) | Tin | - | - | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 140°C | - | Thermoplastic | - |
|
110-87-314-41-605101CONN IC DIP SOCKET 14POS GOLD |
1,288 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
AR28-HZL-TTCONN IC DIP SOCKET 28POS TIN |
1,837 |
|
Datasheet |
- | Bag | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Thermoplastic, Polyester | Beryllium Copper |
|
A-CCS20-Z-RCONN SOCKET PLCC 20POS TIN |
4,320 |
|
Datasheet |
- | Tube | Obsolete | PLCC | 20 (4 x 5) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 150.0µin (3.81µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
|
115-83-308-41-001101CONN IC DIP SOCKET 8POS GOLD |
3,093 |
|
Datasheet |
115 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
116-83-304-41-008101CONN IC DIP SOCKET 4POS GOLD |
1,502 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
05-0518-10HCONN SOCKET SIP 5POS GOLD |
1,232 |
|
Datasheet |
518 | Bulk | Active | SIP | 5 (1 x 5) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
06-1518-10CONN IC DIP SOCKET 6POS GOLD |
4,655 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 6 (2 x 3) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
04-0513-10TCONN SOCKET SIP 4POS GOLD |
2,579 |
|
Datasheet |
0513 | Bulk | Active | SIP | 4 (1 x 4) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
808-AG11D-ESCONN IC DIP SOCKET 8POS GOLD |
1,933 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 25.0µin (0.63µm) | Copper Alloy | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | -55°C ~ 105°C | - | Polyester | - |
|
|
SBU130ZCONN SOCKET SIP 13POS GOLD |
4,927 |
|
Datasheet |
SBU | Bulk | Active | SIP | 13 (1 x 13) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 196.9µin (5.00µm) | Polybutylene Terephthalate (PBT), Glass Filled | Brass |
|
|
02-0513-11CONN SOCKET SIP 2POS GOLD |
1,836 |
|
Datasheet |
0513 | Bulk | Active | SIP | 2 (1 x 2) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | - | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
110-83-306-41-105101CONN IC DIP SOCKET 6POS GOLD |
1,402 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
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