| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
AW 127-28/Z-TSOCKET 28 CONTACTS SINGLE ROW |
2,036 |
|
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
232-68CONN SOCKET PLCC 68POS TIN |
2,787 |
|
Datasheet |
- | Tube | Obsolete | PLCC | 68 (4 x 17) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | -55°C ~ 105°C | 100.0µin (2.54µm) | Polyphenylene Sulfide (PPS), Glass Filled | Phosphor Bronze |
|
|
SIP1X16-014BSIP1X16-014B-SIP SOCKET 16 CTS |
2,829 |
|
Datasheet |
SIP1x | Bulk | Active | SIP | 16 (1 x 16) | Tin-Lead | 150.0µin (3.81µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS), Glass Filled | Brass |
|
A-CCS28-Z-SM-RCONN SOCKET PLCC 28POS TIN |
4,782 |
|
Datasheet |
- | Tube | Obsolete | PLCC | 28 (4 x 7) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | -55°C ~ 105°C | 150.0µin (3.81µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
|
A-CCS44-ZCONN SOCKET PLCC 44POS TIN |
2,426 |
|
Datasheet |
- | Bag | Obsolete | PLCC | 44 (4 x 11) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 150.0µin (3.81µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
|
110-87-308-41-105161CONN IC DIP SOCKET 8POS GOLD |
4,785 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
116-87-308-41-006101CONN IC DIP SOCKET 8POS GOLD |
3,649 |
|
Datasheet |
116 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
382441-3CONN SOCKET SIP 7POS TIN |
2,888 |
|
Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 7 (1 x 7) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic, Glass Filled | Phosphor Bronze |
|
|
2-382568-4CONN IC DIP SOCKET 24POS TIN |
2,492 |
|
Datasheet |
Diplomate DL | Box | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic, Glass Filled | Phosphor Bronze |
|
2-640463-4CONN IC DIP SOCKET 8POS GOLD |
2,798 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 15.0µin (0.38µm) | Thermoplastic, Glass Filled | Phosphor Bronze |
|
ED044PLCZ-SM-NCONN SOCKET PLCC 44POS |
1,516 |
|
Datasheet |
ED | Tube | Active | PLCC | 44 (2 x 22) | - | - | Phosphor Bronze | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | - | -55°C ~ 105°C | - | Polyphenylene Sulfide (PPS) | Phosphor Bronze |
|
|
614-83-306-41-001101CONN IC DIP SOCKET 6POS GOLD |
2,185 |
|
Datasheet |
614 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
AR 08-HZL/07-TTCONN IC DIP SOCKET 8POS GOLD |
1,380 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Thermoplastic, Polyester | Beryllium Copper |
|
123-87-306-41-001101CONN IC DIP SOCKET 6POS GOLD |
3,343 |
|
Datasheet |
123 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
116-83-304-41-007101CONN IC DIP SOCKET 4POS GOLD |
3,576 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
D0806-01CONN IC DIP SOCKET 6POS GOLD |
2,853 |
|
Datasheet |
D0 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 196.9µin (5.00µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
SIP050-1X08-157B1X08-157B-SIP SOCKET 8 CTS |
2,537 |
|
Datasheet |
SIP050-1x | Bulk | Active | SIP | 8 (1 x 8) | Tin | 200.0µin (5.08µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
231-20CONN SOCKET PLCC 20POS GOLD |
3,127 |
|
Datasheet |
- | Tube | Obsolete | PLCC | 20 (4 x 5) | Gold | - | Phosphor Bronze | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 105°C | - | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
|
|
AW 127-29/Z-TSOCKET 29 CONTACTS SINGLE ROW |
3,024 |
|
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
917-87-103-41-005101CONN TRANSIST TO-5 3POS GOLD |
4,739 |
|
Datasheet |
917 | Bulk | Active | Transistor, TO-5 | 3 (Round) | Gold | Flash | Beryllium Copper | - | Through Hole | - | Solder | - | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
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