| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
AR 06-HZW/TNSOCKET |
4,734 |
|
Datasheet |
AR | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | Flash | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Thermoplastic, Polyester, Glass Filled | Brass |
|
|
03-0513-10CONN SOCKET SIP 3POS GOLD |
3,543 |
|
Datasheet |
0513 | Bulk | Active | SIP | 3 (1 x 3) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
121-83-304-41-001101CONN IC DIP SOCKET 4POS GOLD |
2,513 |
|
Datasheet |
121 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
A-CCS028-Z-SM/PSOCKET |
4,936 |
|
Datasheet |
- | Bulk | Active | PLCC | 28 | Tin | 160.0µin (4.06µm) | Phosphor Bronze | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Tin | -40°C ~ 105°C | 160.0µin (4.06µm) | Polyphenylene Sulfide (PPS), Glass Filled | Phosphor Bronze |
|
AR08-HZW/TCONN IC DIP SOCKET 8POS GOLD |
4,142 |
|
Datasheet |
- | Bag | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Thermoplastic, Polyester | Beryllium Copper |
|
A-CCS20-Z-SM-RCONN SOCKET PLCC 20POS TIN |
4,904 |
|
Datasheet |
- | Tube | Obsolete | PLCC | 20 (4 x 5) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | -55°C ~ 105°C | 150.0µin (3.81µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
|
|
SU1210000000GSU-2*6P BLACK ; 10.0MM CLIP PLA |
3,092 |
|
Datasheet |
SU | Bulk | Active | DIP, 0.1" (2.54mm) Row Spacing | 12 (2 x 6) | Tin | 200.0µin (5.08µm) | Brass | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -40°C ~ 105°C | Flash | Polyphenylene Sulfide (PPS) | Beryllium Copper |
|
2-641264-1CONN IC DIP SOCKET 20POS TIN |
3,749 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic, Glass Filled | Beryllium Copper |
|
110-87-610-41-001101CONN IC DIP SOCKET 10POS GOLD |
4,470 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 10 (2 x 5) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
116-83-304-41-012101CONN IC DIP SOCKET 4POS GOLD |
2,105 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
AW 127-26/Z-TSOCKET 26 CONTACTS SINGLE ROW |
4,115 |
|
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
SIP1X14-011BSIP1X14-011B-SIP SOCKET 14 CTS |
1,258 |
|
Datasheet |
SIP1x | Bulk | Active | SIP | 14 (1 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS), Glass Filled | Brass |
|
110-87-312-41-005101CONN IC DIP SOCKET 12POS GOLD |
4,947 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 12 (2 x 6) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
115-87-610-41-001101CONN IC DIP SOCKET 10POS GOLD |
3,962 |
|
Datasheet |
115 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 10 (2 x 5) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
BU080ZCONN IC DIP SOCKET 8POS |
2,179 |
|
Datasheet |
BU | Tube | Active | - | 8 (2 x 4) | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
AR16-HZL/01-TTCONN IC DIP SOCKET 16POS GOLD |
3,968 |
|
Datasheet |
- | Bag | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Thermoplastic, Polyester | Beryllium Copper |
|
A-CCS52-ZCONN SOCKET PLCC 52POS TIN |
2,954 |
|
Datasheet |
- | Bag | Obsolete | PLCC | 52 (4 x 13) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 150.0µin (3.81µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
|
|
04-0518-10HCONN SOCKET SIP 4POS GOLD |
1,868 |
|
Datasheet |
518 | Bulk | Active | SIP | 4 (1 x 4) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
04-1518-10HCONN IC DIP SOCKET 4POS GOLD |
3,477 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 4 (2 x 2) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
05-0518-10CONN SOCKET SIP 5POS GOLD |
2,781 |
|
Datasheet |
518 | Bulk | Active | SIP | 5 (1 x 5) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
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