| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
03-0518-10HCONN SOCKET SIP 3POS GOLD |
3,406 |
|
Datasheet |
518 | Bulk | Active | SIP | 3 (1 x 3) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
115-87-308-41-003101CONN IC DIP SOCKET 8POS GOLD |
3,525 |
|
Datasheet |
115 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
SIP050-1X06-157B1X06-157B-SIP SOCKET 6 CTS |
2,407 |
|
Datasheet |
SIP050-1x | Bulk | Active | SIP | 6 (1 x 6) | Tin | 200.0µin (5.08µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
110-87-310-41-005101CONN IC DIP SOCKET 10POS GOLD |
4,459 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
510-87-012-05-001101CONN SOCKET PGA 12POS GOLD |
2,075 |
|
Datasheet |
510 | Bulk | Active | PGA | 12 (5 x 5) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
614-83-304-31-012101CONN IC DIP SOCKET 4POS GOLD |
4,001 |
|
Datasheet |
614 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
245-22-1-03CONN IC DIP SOCKET 22POS TIN |
4,779 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole, Kinked Pin | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 60.0µin (1.52µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
|
|
SIP050-1X05-160B1X05-160B-SIP SOCKET 5 CTS |
2,892 |
|
Datasheet |
SIP050-1x | Bulk | Active | SIP | 5 (1 x 5) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
115-87-308-41-001101CONN IC DIP SOCKET 8POS GOLD |
3,125 |
|
Datasheet |
115 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
940-99-032-17-400000CONN SOCKET PLCC 32POS TIN-LEAD |
1,948 |
|
Datasheet |
940 | Tube | Obsolete | PLCC | 32 (2 x 7, 2 x 9) | Tin-Lead | 100.0µin (2.54µm) | Beryllium Copper | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
110-83-306-41-001101CONN IC DIP SOCKET 6POS GOLD |
3,364 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
110-87-312-41-001101CONN IC DIP SOCKET 12POS GOLD |
1,979 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 12 (2 x 6) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
A-CCS32-ZCONN SOCKET PLCC 32POS TIN |
2,801 |
|
Datasheet |
- | Bag | Obsolete | PLCC | 32 (2 x 7, 2 x 9) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 150.0µin (3.81µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
|
|
DIP316-011BDIP SOCKET 16 CTS |
3,072 |
|
Datasheet |
- | Bag | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
A08-LCG-T-RCONN IC DIP SOCKET 8POS GOLD |
1,955 |
|
Datasheet |
- | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | - | - | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 105°C | - | Polybutylene Terephthalate (PBT), Glass Filled | - |
|
A-CCS28-ZCONN SOCKET PLCC 28POS TIN |
3,559 |
|
Datasheet |
- | Bag | Obsolete | PLCC | 28 (4 x 7) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 150.0µin (3.81µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
|
|
AW 127-22/Z-TSOCKET 22 CONTACTS SINGLE ROW |
2,933 |
|
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
A 22-LC-TTIC-SOCKETS |
2,987 |
|
Datasheet |
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 85°C | - | Polybutylene Terephthalate (PBT) | Phosphor Bronze |
|
|
146-87-304-41-035101CONN IC DIP SOCKET 4POS GOLD |
1,135 |
|
Datasheet |
146 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
SIP1X02-041BSIP1X02-041B-SIP SOCKET 2 CTS |
3,715 |
|
Datasheet |
SIP1x | Bulk | Active | SIP | 2 (1 x 2) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS), Glass Filled | Brass |
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