| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
1571994-2CONN SOCKET SIP 2POS GOLD |
1,921 |
|
Datasheet |
510 | Bulk | Obsolete | SIP | 2 (1 x 2) | Gold | 20.0µin (0.51µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | 20.0µin (0.51µm) | Thermoplastic, Polyester | Copper |
|
612-83-304-41-001101CONN IC DIP SOCKET 4POS GOLD |
4,106 |
|
Datasheet |
612 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
SIP1X05-041BSIP1X05-041B-SIP SOCKET 5 CTS |
1,770 |
|
Datasheet |
SIP1x | Bulk | Active | SIP | 5 (1 x 5) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS), Glass Filled | Brass |
|
|
1-390263-5CONN IC DIP SOCKET 42POS TIN |
3,532 |
|
Datasheet |
- | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 60.0µin (1.52µm) | - | Phosphor Bronze |
|
|
1-390262-6CONN IC DIP SOCKET 42POS TIN |
3,352 |
|
Datasheet |
- | Box | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 60.0µin (1.52µm) | - | Phosphor Bronze |
|
|
614-87-306-41-001101CONN IC DIP SOCKET 6POS GOLD |
1,162 |
|
Datasheet |
614 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
AR 22-HZL/7-TTSOCKET |
2,754 |
|
Datasheet |
AR | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | Gold | Flash | Brass | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | - | Polybutylene Terephthalate (PBT), Glass Filled | Brass |
|
110-87-306-41-105101CONN IC DIP SOCKET 6POS GOLD |
1,283 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
A-CCS28-Z-SMCONN SOCKET PLCC 28POS TIN |
1,157 |
|
Datasheet |
- | Bag | Obsolete | PLCC | 28 (4 x 7) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | -55°C ~ 105°C | 150.0µin (3.81µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
|
A18-LCGCONN IC DIP SOCKET 18POS GOLD |
4,934 |
|
Datasheet |
- | - | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | - | - | 0.100" (2.54mm) | Through Hole | Open Frame | - | 0.100" (2.54mm) | Gold | - | - | - | - |
|
|
AW 127-20/Z-TSOCKET 20 CONTACTS SINGLE ROW |
4,201 |
|
Datasheet |
- | Bulk | Active | SIP | 20 (1 x 20) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS) | Brass |
|
612-87-306-41-001101CONN IC DIP SOCKET 6POS GOLD |
1,201 |
|
Datasheet |
612 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
A-CCS32-Z-SMCONN SOCKET PLCC 32POS TIN |
4,405 |
|
Datasheet |
- | Bag | Obsolete | PLCC | 32 (2 x 7, 2 x 9) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | -55°C ~ 105°C | 150.0µin (3.81µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
|
|
03-0518-10TCONN SOCKET SIP 3POS GOLD |
1,423 |
|
Datasheet |
518 | Bulk | Active | SIP | 3 (1 x 3) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
01-0517-90CCONN SOCKET SIP 1POS GOLD |
4,899 |
|
Datasheet |
0517 | Bulk | Active | SIP | 1 (1 x 1) | Gold | 30.0µin (0.76µm) | Beryllium Copper | - | Through Hole, Right Angle | - | Solder | - | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
AR16-HZL/07-TTCONN IC DIP SOCKET 16POS GOLD |
3,228 |
|
Datasheet |
- | Bag | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Thermoplastic, Polyester | Beryllium Copper |
|
116-87-304-41-002101CONN IC DIP SOCKET 4POS GOLD |
4,442 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
241-06-1-03CONN IC DIP SOCKET 6POS TIN |
3,527 |
|
Datasheet |
- | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 60.0µin (1.52µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
|
|
AR 10-HZL/01-TTCONN IC DIP SOCKET 10POS TIN |
3,310 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Polybutylene Terephthalate (PBT), Glass Filled | Beryllium Copper |
|
A-CCS20-ZCONN SOCKET PLCC 20POS TIN |
4,968 |
|
Datasheet |
- | Bag | Obsolete | PLCC | 20 (4 x 5) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 150.0µin (3.81µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
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