| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
AW 127-13/Z-TSOCKET 13 CONTACTS SINGLE ROW |
3,705 |
|
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
SIP1X07-014BSIP1X07-014B-SIP SOCKET 7 CTS |
4,813 |
|
Datasheet |
SIP1x | Bulk | Active | SIP | 7 (1 x 7) | Tin-Lead | 150.0µin (3.81µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS), Glass Filled | Brass |
|
|
SIP1X06-001BSIP1X06-001B-SIP SOCKET 6 CTS |
3,951 |
|
Datasheet |
SIP1x | Bulk | Active | SIP | 6 (1 x 6) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS), Glass Filled | Brass |
|
116-87-304-41-006101CONN IC DIP SOCKET 4POS GOLD |
4,314 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
232-20CONN SOCKET PLCC 20POS TIN |
4,721 |
|
Datasheet |
- | Tube | Obsolete | PLCC | 20 (4 x 5) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | -55°C ~ 105°C | 100.0µin (2.54µm) | Polyphenylene Sulfide (PPS), Glass Filled | Phosphor Bronze |
|
|
02-1518-10CONN IC DIP SOCKET 2POS GOLD |
1,660 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 2 (1 x 2) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
SIP41430-001LFCONN SOCKET SIP 2POS TIN |
1,139 |
|
Datasheet |
- | Tape & Reel (TR) | Obsolete | SIP | 2 (1 x 2) | Tin | 200.0µin (5.08µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA), Nylon | Beryllium Copper |
|
|
A 28-LC/7-TCONN IC DIP SOCKET 28POS TIN |
3,714 |
|
Datasheet |
- | Box | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 85°C | 60.0µin (1.52µm) | Polybutylene Terephthalate (PBT) | Phosphor Bronze |
|
232-32CONN SOCKET PLCC 32POS TIN |
2,152 |
|
Datasheet |
- | Tube | Obsolete | PLCC | 32 (4 x 8) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | -55°C ~ 105°C | 100.0µin (2.54µm) | Polyphenylene Sulfide (PPS), Glass Filled | Phosphor Bronze |
|
|
AW 127-14/Z-TSOCKET 14 CONTACTS SINGLE ROW |
2,622 |
|
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
SIP050-1X04-157B1X04-157B-SIP SOCKET 4 CTS |
1,653 |
|
Datasheet |
SIP050-1x | Bulk | Active | SIP | 4 (1 x 4) | Tin | 200.0µin (5.08µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
116-87-304-41-018101CONN IC DIP SOCKET 4POS GOLD |
3,398 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
SIP1X07-011BSIP1X07-011B-SIP SOCKET 7 CTS |
3,035 |
|
Datasheet |
SIP1x | Bulk | Active | SIP | 7 (1 x 7) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS), Glass Filled | Brass |
|
|
115-83-304-41-001101CONN IC DIP SOCKET 4POS GOLD |
3,978 |
|
Datasheet |
115 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
AR06-HZL/07-TTCONN IC DIP SOCKET 6POS GOLD |
1,786 |
|
Datasheet |
- | Bag | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Thermoplastic, Polyester | Beryllium Copper |
|
|
232-28CONN SOCKET PLCC 28POS TIN |
3,998 |
|
Datasheet |
- | Tube | Obsolete | PLCC | 28 (4 x 7) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | -55°C ~ 105°C | 100.0µin (2.54µm) | Polyphenylene Sulfide (PPS), Glass Filled | Phosphor Bronze |
|
A16-LCGCONN IC DIP SOCKET 16POS GOLD |
1,631 |
|
Datasheet |
- | - | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | - | - | 0.100" (2.54mm) | Through Hole | Open Frame | - | 0.100" (2.54mm) | Gold | - | - | - | - |
|
AR08-HZL/01-TTCONN IC DIP SOCKET 8POS GOLD |
3,160 |
|
Datasheet |
- | Bag | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 200.0µin (5.08µm) | Thermoplastic, Polyester | Beryllium Copper |
|
|
HLS-0101-T-2.100" SCREW MACHINE SOCKET ARRAY |
1,911 |
|
Datasheet |
HLS | Tube | Active | SIP | 1 (1 x 1) | Tin | - | - | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | -55°C ~ 140°C | - | Thermoplastic | - |
|
|
614-87-304-31-012101CONN IC DIP SOCKET 320POS GOLD |
3,072 |
|
Datasheet |
614 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 320 (19 x 19) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
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